Title:
LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METHOD FOR BONDING DISSIMILAR ELECTRODES TO ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2014/084080
Kind Code:
A1
Abstract:
When a package having an electrode to which Ni/Au plating or Ag/Pd alloy plating has been applied is bonded by soldering to a printed substrate having a Cu electrode or an electrode to which Cu plating has been applied, a layered solder material for bonding dissimilar electrodes, which is a jointing material of an Sn-Ag-Cu-based solder material or Sn-Sb-based solder material and an Sn-Ag-Cu-Ni-based solder material or Sn-Pb-based solder material, is heated and cooled, whereby a solid-phase diffusion layer is formed on the inside of the layered solder material for bonding dissimilar electrodes. The electrode to which Ni/Au plating or Ag/Pd alloy plating has been applied and the Cu electrode or the electrode to which Cu plating has been applied are bonded by soldering in a state in which the Sn-Ag-Cu-based solder material or the Sn-Pb-based solder material is in contact with the Cu electrode and the Sn-Ag-Cu-Ni-based solder material or the Sn-Cu-based solder material is in contact with the electrode to which Ni/Au plating or Ag/Pd alloy plating has been applied, whereby formation of intermetallic compounds at the bonding interface is minimized and bonding by soldering is performed with high bonding reliability.
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Inventors:
WATANABE KOJI (JP)
TOYODA MINORU (JP)
TOMITA SATOSHI (JP)
SUGINO TSUTOMU (JP)
KIKUCHI DAICHI (JP)
OSHIMA HIROKI (JP)
TOYODA MINORU (JP)
TOMITA SATOSHI (JP)
SUGINO TSUTOMU (JP)
KIKUCHI DAICHI (JP)
OSHIMA HIROKI (JP)
Application Number:
PCT/JP2013/081044
Publication Date:
June 05, 2014
Filing Date:
November 18, 2013
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/14; B23K1/00; B23K1/19; B23K35/26; C22C1/00; C22C11/06; C22C13/00; C22C13/02; H05K3/34; B23K35/40; B23K101/42; B23K103/18
Foreign References:
| JP2006088204A | 2006-04-06 | |||
| JPH11226775A | 1999-08-24 | |||
| JP2004188482A | 2004-07-08 | |||
| JP2005014024A | 2005-01-20 | |||
| JP2013035046A | 2013-02-21 | |||
| JP2000015479A | 2000-01-18 | |||
| JP2006131979A | 2006-05-25 |
Other References:
See also references of EP 2926940A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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