Title:
LAYERED STRUCTURE AND LIGHT-SENSITIVE DRY FILM USED IN SAME
Document Type and Number:
WIPO Patent Application WO/2011/096385
Kind Code:
A1
Abstract:
Provided is a layered structure that has, at least, a substrate (1) and a light-sensitive resin layer or cured coating layer (2), containing an inorganic filler (3), formed on top of the substrate. In the light-sensitive resin layer or cured coating layer, the proportion of the inorganic filler is lower in a surface region opposite the substrate than in other regions, making it possible to keep the coefficient of linear thermal expansion of the entire light-sensitive resin layer or cured coating layer as low as possible while also avoiding losses in resolution and achieving excellent adhesion to an underfill resin section or a molded resin section. Preferably, the light-sensitive resin layer or cured coating layer comprises at least two layers having different inorganic filler proportions, and the surface-side light-sensitive resin layer or cured coating layer opposite the substrate has a lower inorganic filler proportion than the other layer(s). A light-sensitive dry film containing the abovementioned light-sensitive resin layer is suitable for use as an interlayer resin insulation layer or a solder resist in a printed circuit board.
Inventors:
YOSHIDA TAKAHIRO (JP)
MINEGISHI SHOUJI (JP)
ARIMA MASAO (JP)
MINEGISHI SHOUJI (JP)
ARIMA MASAO (JP)
Application Number:
PCT/JP2011/052002
Publication Date:
August 11, 2011
Filing Date:
February 01, 2011
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
YOSHIDA TAKAHIRO (JP)
MINEGISHI SHOUJI (JP)
ARIMA MASAO (JP)
YOSHIDA TAKAHIRO (JP)
MINEGISHI SHOUJI (JP)
ARIMA MASAO (JP)
International Classes:
G03F7/004; G03F7/095; H05K3/28
Foreign References:
| JP2008116910A | 2008-05-22 | |||
| JP2007294427A | 2007-11-08 |
Attorney, Agent or Firm:
Shigeki Yoshida (JP)
YOSHIDA, SHIGEKI (JP)
YOSHIDA, SHIGEKI (JP)
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Claims: