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Patent Searching and Data


Title:
LAYOUT EXTRACTING METHOD AND LAYOUT EXTRACTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/037128
Kind Code:
A1
Abstract:
A space to be split, a rectangular parallelepiped, is split into a plurality of rectangular parallelepiped elements by planes perpendicular to any of X axis, Y axis and Z axis forming three edges to extract a split layout optimum for the features of the space to be split. The split surface are characterized by being selected such that (i) they are all rectangles, (ii) they do not cross each other, and (iii) they pass respective sides of an arbitrary split surface, are perpendicular to the split surface and form T-shapes with a surface outside the surfaces of the space to be split or the split surfaces of other rectangular parallelepiped elements.

Inventors:
OTA HIDENORI (JP)
KODAMA CHIKAAKI (JP)
FUJIYOSHI KUNIHIRO (JP)
YAMADA TOSHINORI (JP)
Application Number:
PCT/JP2006/318204
Publication Date:
April 05, 2007
Filing Date:
September 06, 2006
Export Citation:
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Assignee:
UNIV TOKYO NAT UNIV CORP (JP)
OTA HIDENORI (JP)
KODAMA CHIKAAKI (JP)
FUJIYOSHI KUNIHIRO (JP)
YAMADA TOSHINORI (JP)
International Classes:
G06F17/50
Other References:
KODAIRA Y. ET AL.: "Doteki Saikosei Kano na System no tameno Keisan Shigen Wariate Scheduling Shuho", IEICE TECHNICAL REPORT, THE INSTITUTE OF ELECTRONICS, INFORMATION AND COMMUNICATION ENGINEERS, vol. 104, no. 480, 25 November 2004 (2004-11-25), pages 37 - 42
Attorney, Agent or Firm:
HIRAISHI, Toshiko et al. (Nishi-Shinbashi Minato-ku, Tokyo, JP)
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