LAYOUT SPLITTING METHOD AND APPARATUS SUITABLE FOR DOUBLE LITHOGRAPHY TECHNOLOGY, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/137952

A1

A layout splitting method and apparatus (100) suitable for double lithography technology, and an electronic device (200), which fall within the field of integrated circuit mask designs. The layout splitting method comprises the following steps: providing an initial layout, which comprises a plurality of mask patterns (10); splitting the plurality of mask patterns (10) into conflicting patterns (N) and conflict-free patterns (M) on the basis of a first splitting rule; classifying the conflicting patterns (N) into a first part of mask patterns and a second part of mask patterns on the basis of a second splitting rule; classifying the conflict-free patterns (M) into first-size mask patterns and second-size mask patterns on the basis of a third splitting rule; and combining some of the first-size mask patterns and the second-size mask patterns with the first part of mask patterns to obtain a first layout, and combining the other first-size mask patterns and second-size mask patterns with the second part of mask patterns to obtain a second layout. The present invention has the advantages of a splitting speed being high, and the exposure imaging resolution of a mask formed by two layouts obtained after splitting being high.

YAN GE (CN)
DING MING (CN)

PCT/CN2022/098426

July 27, 2023

June 13, 2022

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SHENZHEN JINGYUAN INFORMATION TECH CO LTD (CN)

G03F7/20

CN114488707A	2022-05-13
CN106339519A	2017-01-18
CN104392074A	2015-03-04
CN109696797A	2019-04-30
CN103091976A	2013-05-08
CN102521425A	2012-06-27
CN112506003A	2021-03-16
US20130061185A1	2013-03-07

SHENZHEN I&W INTELLECTUAL PROPERTY CORPORATION (CN)

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