Title:
LCP EXTRUDED FILM, INSULATING MATERIAL FOR CIRCUIT BOARD, AND METAL FOIL CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/033102
Kind Code:
A1
Abstract:
Provided are: a new LCP extruded film having a high metal foil peel strength; an insulating material for a circuit board and a metal foil clad laminate that use the LCP extruded film; a new production method for an LCP extruded film having a high metal foil peel strength; and the like. This LCP extruded film has a film surface S1 and contains a thermoplastic liquid crystal polymer. The contact angle σ1 of the film surface S1 of the LCP extruded film with respect to water is 60-80° one day after undergoing a constant-temperature and constant-humidity treatment at 23°C and 50%RH. The contact angle σ7 of the film surface S1 of the LCP extruded film with respect to water is 60-80° seven days after undergoing the constant-temperature and constant-humidity treatment at 23°C and 50%RH. The reduction ratio ((σ7 - σ1)/σ1) of the contact angle σ7 with respect to the contact angle σ1 is at most 10.0%.
Inventors:
ISHIZUKA RYOTA (JP)
MASUDA YUSUKE (JP)
OGAWA NAOKI (JP)
MASUDA YUSUKE (JP)
OGAWA NAOKI (JP)
Application Number:
PCT/JP2022/032930
Publication Date:
March 09, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/12; B29C48/21; B29C48/25; B32B15/08; C08J5/18; H05K1/03
Foreign References:
| JPH08302208A | 1996-11-19 | |||
| JP2017192875A | 2017-10-26 | |||
| JP2019218485A | 2019-12-26 | |||
| JP2018154409A | 2018-10-04 | |||
| JPS6331729A | 1988-02-10 | |||
| JP2010221694A | 2010-10-07 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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