LEAD ALLOY TAPE BARRI ER

RELATED APPLICATIONS

[0001] This application claims priority to and the benefit of a US provisional application having Serial No. 62/167,445, filed 28 May 2015, which is incorporated by reference herein.

BACKGROUND

[0002] Equipment used in the oil and gas industry may be exposed to high- temperature and/or high-pressure environments. Such environments may also be chemically harsh, for example, consider environments that may include chemicals such as hydrogen sulfide, carbon dioxide, etc. Various types of environmental conditions can damage equipment.

SUMMARY

[0003] A power cable can include a conductor; insulation disposed about the conductor; and a lead (Pb) alloy tape wrapped about the insulation. A method can include extruding an electrical insulation layer over an electrical conductor; and wrapping a lead (Pb) alloy tape over the electrical insulation layer. An electric submersible pump power cable can include a plurality of insulated conductors where each of the insulated conductors includes lead (Pb) alloy tape wrapped thereabout. Various other apparatuses, systems, methods, etc., are also disclosed.

[0004] This summary is provided to introduce a selection of concepts that are further described below in the detailed description. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in limiting the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Features and advantages of the described implementations can be more readily understood by reference to the following description taken in conjunction with the accompanying drawings.

[0006] Fig. 1 illustrates examples of equipment in geologic environments;

[0007] Fig. 2 illustrates an example of an electric submersible pump system;

[0008] Fig. 3 illustrates examples of equipment; [0009] Fig. 4 illustrates examples of cables;

[0010] Fig. 5 illustrates an example of a motor lead extension;

[0011] Fig. 6 illustrates examples of arrangements;

[0012] Fig. 7 illustrates an examples of cables;

[0013] Fig. 8 illustrates an example of a method;

[0014] Fig. 9 illustrates example plots of lead (Pb) alloys, examples of tape that include alloys and examples of wrapping tape;

[0015] Fig. 10 illustrates example plots;

[0016] Fig. 1 1 illustrates examples of tape wrapped insulated conductors;

[0017] Fig. 12 illustrates examples of processing equipment;

[0018] Fig. 13 illustrates an example of process, an example of a composite and an example of a plot;

[0019] Fig. 14 illustrates an example of a system; and

[0020] Fig. 15 illustrates example components of a system and a networked system.

DETAI LED DESCRIPTION

[0021] The following description includes the best mode presently

contemplated for practicing the described implementations. This description is not to be taken in a limiting sense, but rather is made merely for the purpose of describing the general principles of the implementations. The scope of the described implementations should be ascertained with reference to the issued claims.

[0022] A gas well may be defined by its gas oil ratio (GOR). For example, some states within the United States have statutes that provide definitions, for example, where a gas well is one where the GOR is greater than 100,000 ft ³ /bbl or 100 Mcf/bbl.

[0023] In high GOR wells, an electric submersible pump (ESP) power cables and motor lead extensions (MLEs) may be exposed to high concentration of corrosive and sour gases and fluids. To protect dielectric layers and copper conductors, metallic lead (Pb) sheaths can be employed as a barrier layer to block permeation of downhole media.

[0024] As an example, a power cable for a downhole application may include an extruded continuous metallic lead (Pb) barrier layer that aims to protect materials interiorly disposed thereto from downhole media such as, for example, one or more corrosive gases (e.g., consider CO2 and H2S). While such an extruded lead (Pb) barrier tends to be quite effective at inhibiting gas permeation, process constraints can exist. For example, physically, a minimum manufacturing wall thickness of the metallic lead (Pb) can be specified (e.g., from about 20 mils to about 60 mils or about

0.5 mm to about 1 .5 mm) that aims to help ensure effective protection from corrosive gases. Such specifications can account for one or more types of variations within a manufacturing process, which may result in increased material usage and increased production costs. Further, as the density of metallic lead (Pb) is about 1 1 grams per cubic centimeter, the mass of a metallic lead (Pb) layer can increase mass of a cable, which, in turn, can impact other equipment, operations, etc. For example, in certain applications the weight and increased cable size of metallic lead (Pb) sheathed cables can impact ease of handling and installation.

[0025] As an example, a cable may include one or more lead (Pb) alloy layers (e.g., including at least lead (Pb) and tin (Sn)) that may act as a barrier or barriers. In such an example, the one or more lead (Pb) alloy layers may be part of a tape or tapes. As an example, a tape can include one or more lead (Pb) alloy layers and adhesive. As an example, a tape may include one or more lead (Pb) alloy layers that may be of a thickness that is less than that of a metallic lead (Pb) barrier layer of a cable (e.g. , a comparable cable). Such an approach may reduce cable weight, for example, when compared to cable weight for a cable that includes one or more metallic lead (Pb) layers.

[0026] Fig. 1 shows examples of geologic environments 120 and 140. In Fig.

1 , the geologic environment 120 may be a sedimentary basin that includes layers (e.g., stratification) that include a reservoir 121 and that may be, for example, intersected by a fault 123 (e.g., or faults). As an example, the geologic environment 120 may be outfitted with any of a variety of sensors, detectors, actuators, etc. For example, equipment 122 may include communication circuitry to receive and to transmit information with respect to one or more networks 125. Such information may include information associated with downhole equipment 124, which may be equipment to acquire information, to assist with resource recovery, etc. Other equipment 126 may be located remote from a well site and include sensing, detecting, emitting or other circuitry. Such equipment may include storage and communication circuitry to store and to communicate data, instructions, etc. As an example, one or more satellites may be provided for purposes of communications, data acquisition, etc. For example, Fig. 1 shows a satellite in communication with the network 125 that may be configured for communications, noting that the satellite may additionally or alternatively include circuitry for imagery (e.g., spatial, spectral, temporal, radiometric, etc.).

[0027] Fig. 1 also shows the geologic environment 120 as optionally including equipment 127 and 128 associated with a well that includes a substantially horizontal portion that may intersect with one or more fractures 129. For example, consider a well in a shale formation that may include natural fractures, artificial fractures (e.g. , hydraulic fractures) or a combination of natural and artificial fractures. As an example, a well may be drilled for a reservoir that is laterally extensive. In such an example, lateral variations in properties, stresses, etc. may exist where an

assessment of such variations may assist with planning, operations, etc. to develop the reservoir (e.g., via fracturing, injecting, extracting, etc.). As an example, the equipment 127 and/or 128 may include components, a system, systems, etc. for fracturing, seismic sensing, analysis of seismic data, assessment of one or more fractures, etc.

[0028] As to the geologic environment 140, as shown in Fig. 1 , it includes two wells 141 and 143 (e.g., bores), which may be, for example, disposed at least partially in a layer such as a sand layer disposed between caprock and shale. As an example, the geologic environment 140 may be outfitted with equipment 145, which may be, for example, steam assisted gravity drainage (SAGD) equipment for injecting steam for enhancing extraction of a resource from a reservoir. SAGD is a technique that involves subterranean delivery of steam to enhance flow of heavy oil, bitumen, etc. SAGD can be applied for Enhanced Oil Recovery (EOR), which is also known as tertiary recovery because it changes properties of oil in situ.

[0029] As an example, a SAGD operation in the geologic environment 140 may use the well 141 for steam-injection and the well 143 for resource production. In such an example, the equipment 145 may be a downhole steam generator and the equipment 147 may be an electric submersible pump (e.g. , an ESP). As an example, one or more electrical cables may be connected to the equipment 145 and one or more electrical cables may be connected to the equipment 147. For example, as to the equipment 145, a cable may provide power to a heater to generate steam, to a pump to pump water (e.g., for steam generation), to a pump to pump fuel (e.g. , to burn to generate steam), etc. As to the equipment 147, for example, a cable may provide power to power a motor, power a sensor (e.g. , a gauge), etc.

[0030] As illustrated in a cross-sectional view of Fig. 1 , steam injected via the well 141 may rise in a subterranean portion of the geologic environment and transfer heat to a desirable resource such as heavy oil. In turn, as the resource is heated, its viscosity decreases, allowing it to flow more readily to the well 143 (e.g., a resource production well). In such an example, equipment 147 may then assist with lifting the resource in the well 143 to, for example, a surface facility (e.g. , via a wellhead, etc.).

[0031] As to a downhole steam generator, as an example, it may be fed by three separate streams of natural gas, air and water (e.g. , via conduits) where a gas- air mixture is combined first to create a flame and then the water is injected downstream to create steam. In such an example, the water can also serve to cool a burner wall or walls (e.g., by flowing in a passageway or passageways within a wall). As an example, a SAGD operation may result in condensed steam accompanying a resource (e.g. , heavy oil) to a well. In such an example, where a production well includes artificial lift equipment such as an ESP, operation of such equipment may be impacted by the presence of condensed steam (e.g., water). Further, as an example, condensed steam may place demands on separation processing where it is desirable to separate one or more components from a hydrocarbon and water mixture.

[0032] Each of the geologic environments 120 and 140 of Fig. 1 may include harsh environments therein. For example, a harsh environment may be classified as being a high-pressure and high-temperature environment. A so-called HPHT environment may include pressures up to about 138 MPa (e.g., about 20,000 psi) and temperatures up to about 205 degrees C (e.g., about 400 degrees F), a so- called ultra-HPHT environment may include pressures up to about 241 MPa (e.g., about 35,000 psi) and temperatures up to about 260 degrees C (e.g. , about 500 degrees F) and a so-called HPHT-hc environment may include pressures greater than about 241 MPa (e.g. , about 35,000 psi) and temperatures greater than about 260 degrees C (e.g., about 500 degrees F). As an example, an environment may be classified based in one of the aforementioned classes based on pressure or temperature alone. As an example, an environment may have its pressure and/or temperature elevated, for example, through use of equipment, techniques, etc. For example, a SAGD operation may elevate temperature of an environment (e.g., by 100 degrees C or more).

[0033] As an example, an environment may be classified based at least in part on its chemical composition. For example, where an environment includes hydrogen sulfide (H2S), carbon dioxide (CO2), etc., the environment may be corrosive to certain materials. As an example, an environment may be classified based at least in part on particulate matter that may be in a fluid (e.g., suspended, entrained, etc.). As an example, particulate matter in an environment may be abrasive or otherwise damaging to equipment. As an example, matter may be soluble or insoluble in an environment and, for example, soluble in one environment and substantially insoluble in another.

[0034] Conditions in a geologic environment may be transient and/or persistent. Where equipment is placed within a geologic environment, longevity of the equipment can depend on characteristics of the environment and, for example, duration of use of the equipment as well as function of the equipment. For example, a high-voltage power cable may itself pose challenges regardless of the environment into which it is placed. Where equipment is to endure in an environment over a substantial period of time, uncertainty may arise in one or more factors that could impact integrity or expected lifetime of the equipment. As an example, where a period of time may be of the order of decades, equipment that is intended to last for such a period of time should be constructed with materials that can endure environmental conditions imposed thereon, whether imposed by an environment or environments and/or one or more functions of the equipment itself.

[0035] Fig. 2 shows an example of an ESP system 200 that includes an ESP 210 as an example of equipment that may be placed in a geologic environment. As an example, an ESP may be expected to function in an environment over an extended period of time (e.g. , optionally of the order of years). As an example, a commercially available ESP (such as one of the REDA™ ESPs marketed by

Schlumberger Limited, Houston, Texas) may be employed to pump fluid(s).

[0036] In the example of Fig. 2, the ESP system 200 includes a network 201 , a well 203 disposed in a geologic environment, a power supply 205, the ESP 210, a controller 230, a motor controller 250 and a variable speed drive (VSD) unit 270. The power supply 205 may receive power from a power grid, an onsite generator (e.g., natural gas driven turbine), or other source. The power supply 205 may supply a voltage, for example, of about 4.16 kV or more.

[0037] As shown, the well 203 includes a wellhead that can include a choke (e.g., a choke valve). For example, the well 203 can include a choke valve to control various operations such as to reduce pressure of a fluid from high pressure in a closed wellbore to atmospheric pressure. Adjustable choke valves can include valves constructed to resist wear due to high-velocity, solids-laden fluid flowing by restricting or sealing elements. A wellhead may include one or more sensors such as a temperature sensor, a pressure sensor, a solids sensor, etc.

[0038] As to the ESP 210, it is shown as including cables 21 1 (e.g., or a cable), a pump 212, gas handling features 213, a pump intake 214, a motor 215, one or more sensors 216 (e.g., temperature, pressure, current leakage, vibration, etc.) and optionally a protector 217. The well 203 may include one or more well sensors 220. As an example, a fiber-optic based sensor or other type of sensor may provide for real time sensing of temperature, for example, in SAGD or other operations. As shown in the example of Fig. 1 , a well can include a relatively horizontal portion. Such a portion may collect heated heavy oil responsive to steam injection.

Measurements of temperature along the length of the well can provide for feedback, for example, to understand conditions downhole of an ESP. Well sensors may extend into a well and beyond a position of an ESP.

[0039] In the example of Fig. 2, the controller 230 can include one or more interfaces, for example, for receipt, transmission or receipt and transmission of information with the motor controller 250, the VSD unit 270, the power supply 205 (e.g., a gas fueled turbine generator, a power company, etc.), the network 201 , equipment in the well 203, equipment in another well, etc.

[0040] As shown in Fig. 2, the controller 230 can include or provide access to one or more modules or frameworks. Further, the controller 230 may include features of a motor controller and optionally supplant the motor controller 250. For example, the controller 230 may include the UNICONN™ motor controller 282 marketed by Schlumberger Limited (Houston, Texas). In the example of Fig. 2, the controller 230 may access one or more of the PI PESI M™ framework 284, the ECLIPSE™ framework 286 marketed by Schlumberger Limited (Houston, Texas) and the PETREL™ framework 288 marketed by Schlumberger Limited (Houston, Texas) (e.g. , and optionally the OCEAN™ framework marketed by Schlumberger Limited (Houston, Texas)).

[0041] In the example of Fig. 2, the motor controller 250 may be a

commercially available motor controller such as the UNICONN™ motor controller. As an example, the UNICONN™ motor controller can perform some control and data acquisition tasks for ESPs, surface pumps or other monitored wells. For example, the UNICONN™ motor controller can interface with the PHOENIX™ monitoring system, for example, to access pressure, temperature and vibration data and various protection parameters as well as to provide direct current power to downhole sensors. The UNICONN™ motor controller can interface with fixed speed drive (FSD) controllers or a VSD unit, for example, such as the VSD unit 270.

[0042] For FSD controllers, the UNICONN™ motor controller can monitor ESP system three-phase currents, three-phase surface voltage, supply voltage and frequency, ESP spinning frequency and leg ground, power factor and motor load.

[0043] For VSD units, the UNICONN™ motor controller can monitor VSD output current, ESP running current, VSD output voltage, supply voltage, VSD input and VSD output power, VSD output frequency, drive loading, motor load, three- phase ESP running current, three-phase VSD input or output voltage, ESP spinning frequency, and leg-ground.

[0044] The UNICONN™ motor controller can include control functionality for VSD units such as target speed, minimum and maximum speed and base speed (voltage divided by frequency); three jump frequencies and bandwidths; volts per hertz pattern and start-up boost; ability to start an ESP while the motor is spinning; acceleration and deceleration rates, including start to minimum speed and minimum to target speed to maintain constant pressure/load (e.g. , from about 0.01 Hz/10,000 s to about 1 Hz/s); stop mode with PWM carrier frequency; base speed voltage selection; rocking start frequency, cycle and pattern control; stall protection with automatic speed reduction; changing motor rotation direction without stopping;

speed force; speed follower mode; frequency control to maintain constant speed, pressure or load; current unbalance; voltage unbalance; overvoltage and

undervoltage; ESP backspin; and leg-ground.

[0045] In the example of Fig. 2, the motor controller 250 includes various modules to handle, for example, backspin of an ESP, sanding of an ESP, flux of an ESP and gas lock of an ESP. As an example, the motor controller 250 may include one or more of such features, other features, etc.

[0046] In the example of Fig. 2, the VSD unit 270 may be a low voltage drive (LVD) unit, a medium voltage drive (MVD) unit or other type of unit (e.g. , a high voltage drive, which may provide a voltage in excess of about 4.16 kV). For a LVD, a VSD unit can include a step-up transformer, control circuitry and a step-up transformer while, for a MVD, a VSD unit can include an integrated transformer and control circuitry. As an example, the VSD unit 270 may receive power with a voltage of about 4.16 kV and control a motor as a load with a voltage from about 0 V to about 4.16 kV.

[0047] The VSD unit 270 may include commercially available control circuitry such as the SPEEDSTAR™ MVD control circuitry marketed by Schlumberger Limited (Houston, Texas). The SPEEDSTAR™ MVD control circuitry is suitable for indoor or outdoor use and comes standard with a visible fused disconnect switch, precharge circuitry, and sine wave output filter (e.g., integral sine wave filter, ISWF) tailored for control and protection of high-horsepower ESPs. The SPEEDSTAR™ MVD control circuitry can include a plug-and-play sine wave output filter, a multilevel PWM inverter output, a 0.95 power factor, programmable load reduction (e.g., soft- stall function), speed control circuitry to maintain constant load or pressure, rocking start (e.g., for stuck pumps resulting from scale, sand, etc.), a utility power receptacle, an acquisition system for the PHOENIX™ monitoring system, a site communication box to support surveillance and control service, a speed control potentiometer. The SPEEDSTAR™ MVD control circuitry can optionally interface with the UNICONN™ motor controller, which may provide some of the foregoing functionality.

[0048] In the example of Fig. 2, the VSD unit 270 is shown along with a plot of a sine wave (e.g., achieved via a sine wave filter that includes a capacitor and a reactor), responsiveness to vibration, responsiveness to temperature and as being managed to reduce mean time between failures (MTBFs). The VSD unit 270 may be rated with an ESP to provide for about 40,000 hours (5 years) of operation (e.g. , depending on environment, load, etc.). The VSD unit 270 may include surge and lightening protection (e.g., one protection circuit per phase). As to leg-ground monitoring or water intrusion monitoring, such types of monitoring may indicate whether corrosion is or has occurred. Further monitoring of power quality from a supply, to a motor, at a motor, may occur by one or more circuits or features of a controller.

[0049] While the example of Fig. 2 shows an ESP that may include centrifugal pump stages, another type of ESP may be controlled. For example, an ESP may include a hydraulic diaphragm electric submersible pump (HDESP), which is a positive-displacement, double-acting diaphragm pump with a downhole motor.

HDESPs find use in low-liquid-rate coalbed methane and other oil and gas shallow wells that benefit from artificial lift to remove water from the wellbore. HDESPs may handle a wide variety of fluids and, for example, up to about 2% sand, coal, fines and H2S/CO2.

[0050] As an example, an ESP may include a REDA™ HOTLINE™ high- temperature ESP motor. Such a motor may be suitable for implementation in various types of environments. As an example, a REDA™ HOTLINE™ high- temperature ESP motor may be implemented in a thermal recovery heavy oil production system, such as, for example, SAGD system or other steam-flooding system.

[0051] As an example, an ESP motor can include a three-phase squirrel cage with two-pole induction. As an example, an ESP motor may include steel stator laminations that can help focus magnetic forces on rotors, for example, to help reduce energy loss. As an example, stator windings can include copper and insulation. As an example, a motor may be a multiphase motor. As an example, a motor may include windings, etc., for three or more phases.

[0052] For connection to a power cable or motor lead extensions (MLEs), a motor may include a pothead. Such a pothead may, for example, provide for a tape- in connection with metal-to-metal seals and/or metal-to-elastomer seals (e.g. , to provide a barrier against fluid entry). A motor may include one or more types of potheads or connection mechanisms. As an example, a pothead unit may be provided as a separate unit configured for connection, directly or indirectly, to a motor housing.

[0053] As an example, a motor may include dielectric oil (e.g. , or dielectric oils), for example, that may help lubricate one or more bearings that support a shaft rotatable by the motor. A motor may be configured to include an oil reservoir, for example, in a base portion of a motor housing, which may allow oil to expand and contract with wide thermal cycles. As an example, a motor may include an oil filter to filter debris.

[0054] As an example, a motor housing can house stacked laminations with electrical windings extending through slots in the stacked laminations. The electrical windings may be formed from magnet wire that includes an electrical conductor and at least one polymeric dielectric insulator surrounding the electrical conductor. As an example, a polymeric insulation layer may include a single layer or multiple layers of dielectric tape that may be helically wrapped around an electrical conductor and that may be bonded to the electrical conductor (e.g. , and to itself) through use of an adhesive. As an example, a motor housing may include slot liners. For example, consider a material that can be positioned between windings and laminations.

[0055] Fig. 3 shows a block diagram of an example of a system 300 that includes a power cable 400 and MLEs 500. As shown, the system 300 includes a power source 301 as well as data 302. In the example of Fig. 3, the power source 301 can provide power to a VSD/step-up transformer block 370 while the data 302 may be provided to a communication block 330. The data 302 may include instructions, for example, to instruct circuitry of the circuitry block 350, one or more sensors of the sensor block 360, etc. The data 302 may be or include data communicated, for example, from the circuitry block 350, the sensor block 360, etc. In the example of Fig. 3, a choke block 340 can provide for transmission of data signals via the power cable 400 and the MLEs 500.

[0056] As shown, the MLEs 500 connect to a motor block 315, which may be a motor (or motors) of a pump (e.g., an ESP, etc.) and be controllable via the VSD/step-up transformer block 370. In the example of Fig. 3, the conductors of the MLEs 500 electrically connect at a WYE point 325. The circuitry block 350 may derive power via the WYE point 325 and may optionally transmit, receive or transmit and receive data via the WYE point 325. As shown, the circuitry block 350 may be grounded.

[0057] The system 300 can operate in a normal state (State A) and in a ground fault state (State B). One or more ground faults may occur for any of a variety of reasons. For example, wear of the power cable 400 may cause a ground fault for one or more of its conductors. As another example, wear of one of the MLEs may cause a ground fault for its conductor. As an example, gas intrusion, fluid intrusion, etc. may degrade material(s), which may possibly lead a ground fault. [0058] The system 300 may include provisions to continue operation of a motor of the motor block 315 when a ground fault occurs. However, when a ground fault does occur, power at the WYE point 325 may be altered. For example, where DC power is provided at the WYE point 325 (e.g. , injected via the choke block 340), when a ground fault occurs, current at the WYE point 325 may be unbalanced and alternating. The circuitry block 350 may or may not be capable of deriving power from an unbalanced WYE point and, further, may or may not be capable of data transmission via an unbalanced WYE point.

[0059] The foregoing examples, referring to "normal" and "ground fault" states, demonstrate how ground faults can give rise to various issues. Power cables and MLEs that can resist damaging forces, whether mechanical, electrical or chemical, can help ensure proper operation of a motor, circuitry, sensors, etc. Noting that a faulty power cable (or MLE) can potentially damage a motor, circuitry, sensors, etc. Further, as mentioned, an ESP may be located several kilometers into a wellbore. Accordingly, the time and cost to replace a faulty ESP, power cable, MLE, etc., can be substantial.

[0060] Fig. 4 shows an example of the power cable 400, suitable for use in the system 300 of Fig. 3 or optionally one or more other systems (e.g., SAGD, etc.). In the example of Fig. 4, the power cable 400 includes three conductor assemblies where each assembly includes a conductor 410, a conductor shield 420, insulation 430, an insulation shield 440, a metallic shield 450, and one or more barrier layers 460. The three conductor assemblies are seated in a cable jacket 470, which is surrounded by a first layer of armor 480 and a second layer of armor 490. As to the cable jacket 470, it may be round or as shown in an alternative example 401 , rectangular (e.g. , "flat").

[0061] As an example, a power cable may include, for example, conductors that are made of copper (see, e.g. , the conductors 410); an optional conductor shield for each conductor (see, e.g., the conductor shield 420), which may be provided for voltage ratings in excess of about 5 kV; insulation such as high density polyethylene (HDPE), polypropylene or EPDM (e.g. , where The E refers to ethylene, P to propylene, D to diene and M refers to a classification in ASTM standard D-1418; e.g. , ethylene copolymerized with propylene and a diene or ethylene propylene diene monomer (M-class) rubber) dependent on temperature rating (see, e.g., the insulation 430); an optional insulation shield (see, e.g. , the insulation shield 440), which may be provided for voltage ratings in excess of about 5 kV; an optional metallic shield that may include metallic lead (Pb) (see, e.g. , the metallic shield 450); a barrier layer that may include fluoropolymer (see, e.g., the barrier layer(s) 460); a jacket that may include oil resistant EPDM or nitrile rubber (see, e.g. , the cable jacket 470); and one or more layers of armor that may include galvanized, stainless steel, MONEL™ alloy (marketed by Inco Alloys International, Inc., Huntington, West Virginia), etc. (see, e.g., the armor 480 and the armor 490).

[0062] As an example, the metallic shield 450 may be considered a barrier layer, for example, which may be formed of a continuous metallic lead (Pb) sheath as extruded about the insulation 430 and/or the insulation shield 440, if present.

[0063] In some commercially available REDAMAX™ cables,

polytetrafluoroethylene (PTFE) tape is used to form a barrier layer to block fluid and gas entry. For REDALEAD™ cables, metallic lead (Pb) is extruded directly on top of the insulation (see, e.g., the insulation 430 and/or the insulation shield 440) to help prevent diffusion of gas into the insulation (e.g., one or more corrosive gases). The high barrier properties and malleability of metallic lead (Pb) tend to make it a suitable candidate for downhole cable components.

[0064] In the example of Fig. 4, as to the conductor 410, it may be solid or compacted stranded high purity copper and coated with a metal or alloy (e.g., tin, lead, nickel, silver or other metal or alloy). As to the conductor shield 420, it may optionally be a semiconductive material with a resistivity less than about 5000 ohm- m and be adhered to the conductor 410 in a manner that acts to reduce voids therebetween (e.g. , consider a substantially voidless adhesion interface). As an example, the conductor shield 420 may be provided as an extruded polymer that penetrates into spaces between strands of the stranded conductor 410. As to extrusion of the conductor shield 420, it may optionally be co-extruded or tandem extruded with the insulation 430 (e.g., which may be EPDM or another type of insulation). As an option, nanoscale fillers may be included for low resistivity and suitable mechanical properties (e.g. , for high temperature thermoplastics).

[0065] As to the Insulation 430, it may be bonded to the conductor shield 420. As an example, the insulation 430 may include polyether ether ketone (PEEK), EPDM and/or another suitable electrically insulating material.

[0066] As to the insulation shield 440, it may optionally be a semiconductive material having a resistivity less than about 5000 ohm-m. The insulation shield 440 may be adhered to the insulation 430, but, for example, removable for splicing, without leaving any substantial amounts of residue. As an example, the insulation shield 440 may be extruded polymer, for example, co-extruded with the insulation 430.

[0067] As to the metallic shield 450 and the barrier layer(s) 460, one or more layers of material may be provided. One or more layers may be provided, for example, to create an impermeable gas barrier. As an example, the cable 400 may include PTFE fluoropolymer, for example, as tape that may be helically taped.

[0068] As to the cable jacket 470, it may be round or as shown in the example 401 , rectangular (e.g. , "flat"). As to material of construction, a cable jacket may include one or more layers of EPDM, nitrile, hydrogenated nitrile butadiene rubber (HNBR), fluoropolymer, chloroprene, or other material (e.g. , to provide for resistance to a downhole and/or other environment). As an example, each conductor assembly phase may include solid metallic tubing, such that splitting out the phases is more easily accomplished (e.g., to terminate at a connector, to provide improved cooling, etc.).

[0069] As to the cable armor 480 and 490, metal or metal alloy may be employed, optionally in multiple layers for improved damage resistance.

[0070] Fig. 5 shows an example of one of the MLEs 500 suitable for use in the system 300 of Fig. 3 or optionally one or more other systems (e.g., SAGD, etc.). In the example of Fig. 5, the MLE 500 (or "lead extension") a conductor 510, a conductor shield 520, insulation 530, an insulation shield 540, an optional metallic shield 550, one or more barrier layers 560, a braid layer 570 and armor 580. While the example of Fig. 5 mentions MLE or "lead extension", it may be implemented as a single conductor assembly cable for any of a variety of downhole uses.

[0071] As to a braid or a braided layer, various types of materials may be used such as, for example, polyethylene terephthalate (PET) (e.g., applied as a protective braid, tape, fabric wrap, etc.). PET may be considered as a low cost and high strength material. As an example, a braid layer can help provide protection to a soft lead jacket during an armor wrapping process. In such an example, once downhole, the function of the braid may be minimal. As to other examples, nylon or glass fiber tapes and braids may be implemented. Yet other examples can include fabrics, rubberized tapes, adhesive tapes, and thin extruded films. [0072] As an example, a conductor (e.g., solid or stranded) may be

surrounded by a semiconductive material layer that acts as a conductor shield where, for example, the layer has a thickness greater than approximately 0.005 inch (e.g., approximately 0.127 mm). As an example, a cable can include a conductor with a conductor shield that has a radial thickness of approximately 0.010 inch (e.g., approximately 0.254 mm). As an example, a cable can include a conductor with a conductor shield that has a radial thickness in a range from greater than

approximately 0.005 inch to approximately 0.015 inch (e.g. , approximately 0.127 mm to approximately 0.38 mm).

[0073] As an example, a conductor may have a conductor size in a range from approximately #8 AWG (e.g., OD approx. 0.128 inch or area of approx. 8.36 mm ² ) to approximately #2/0 "00" AWG (e.g., OD approx. 0.365 inch or area of approx. 33.6 mm ² ). As examples, a conductor configuration may be solid or stranded (e.g. , including compact stranded). As an example, a conductor may be smaller than #8 AWG or larger than #2/0 "00" AWG (e.g. , #3/0 "000" AWG, OD approx. 0.41 inch or area of approx. 85 mm ² ).

[0074] As an example, a cable may include a conductor that has a size within a range of approximately 0.1285 inch to approximately 0.414 inch (e.g.,

approximately 3.26 mm to approximately 10.5 mm) and a conductor shield layer that has a radial thickness within a range of approximately greater than 0.005 inch to approximately 0.015 inch (e.g., approximately 0.127 mm to approximately 0.38 mm).

[0075] Fig. 6 shows an example of a geometric arrangement of components of a round cable 610 and an example of a geometric arrangement of components of an oblong cable 630. As shown the cable 610 includes three conductors 612, a polymeric layer 614 and an outer layer 616 and the oblong cable 630 includes three conductors 632, a polymeric layer 634 (e.g., optionally a composite material with desirable heat transfer properties) and an optional outer polymeric layer 636 (e.g., outer polymeric coat, which may be a composite material). In the examples of Fig. 6, a conductor may be surrounded by one or more optional layers, as generally illustrated via dashed lines. For example, as to the cable 630, consider three 1 gauge conductors (e.g. , a diameter of about 7.35 mm) with various layers. In such an example, the polymeric layer 634 may encapsulate the three 1 gauge conductors and their respective layers where, at ends, the polymeric layer 634 may be about 1 mm thick. In such an example, an optional armor layer may be of a thickness of about 0.5 mm. In such an example, the optional outer polymeric layer 636 (e.g. , as covering armor) may be of a thickness of about 1 mm (e.g., a 1 mm layer).

[0076] As shown in Fig. 6, the cable 610 includes a circular cross-sectional shape while the cable 630 includes an oblong cross-sectional shape. In the example of Fig. 6, the cable 610 with the circular cross-sectional shape has an area of unity and the cable 630 with the oblong cross-sectional shape has area of about 0.82. As to perimeter, where the cable 610 has a perimeter of unity, the cable 630 has a perimeter of about 1.05. Thus, the cable 630 has a smaller volume and a larger surface area when compared to the cable 610. A smaller volume can provide for a smaller mass and, for example, less tensile stress on a cable that may be deployed a distance in a downhole environment (e.g. , due to mass of the cable itself).

[0077] In the cable 630, the conductors 632 may be about 7.35 mm (e.g. , about 1 AWG) in diameter with insulation of about 2 mm thickness, metallic lead (Pb) of about 1 mm thickness, a jacket layer (e.g. , the layer 634) over the lead (Pb) of about 1 mm thickness at ends of the cable 630, optional armor of about 0.5 mm thickness and an optional polymeric layer of about 1 mm thickness (e.g., the layer 636 as an outer polymeric coat). As an example, armor can include a strap thickness, which may be singly or multiply applied (e.g., double, triple, etc.). As an example, the cable 630 may be of a width of about 20 mm (e.g. , about 0.8 inches) and a length of about 50 mm (e.g., about 2 inches), for example, about a 2.5 to 1 width to length ratio).

[0078] As an example, a cable may be formed with phases split out from each other where each phase is encased in solid metallic tubing.

[0079] As an example, a cable can include multiple conductors where each conductor can carry current of a phase of a multiphase power supply for a

multiphase electric motor. In such an example, a conductor may be in a range from about 8 AWG (about 3.7 mm) to about 00 AWG (about 9.3 mm).

[0080] Table 1 . Examples of Components.

Jacket over Lead (Pb) 20 mils to 85 mils (0.5 mm to 2.2 mm)

Armor (e.g., optional) 10 mils to 120 mils (0.25 mm to 3 mm)

Polymeric Coat (e.g., optional) 20 mils to 60 mils (0.5 mm to 1.5 mm)

[0081] In Table 1 , where a cable has an oblong cross-sectional shape, the jacket over the metallic lead (Pb) layer may be, for example, of a thickness of about 20 mils to about 85 mils (e.g., about 0.5 mm to about 2.2 mm) at ends of the oblong cross-sectional shape and, for example, at various points along opposing sides of the oblong cross-sectional shape. For example, material forming the jacket over the metallic lead (Pb) layer may be thicker in regions between conductors (e.g., consider approximately triangular shaped regions).

[0082] As an example, a cable may include conductors for delivery of power to a multiphase electric motor with a voltage range of about 3 kV to about 8 kV. As an example, a cable may carry power, at times, for example, with amperage of up to about 200 A or more.

[0083] As to operational conditions, where an electric motor operates a pump, locking of the pump can cause current to increase and, where fluid flow past a cable may decrease, heat may build rapidly within the cable. As an example, locking may occur due to gas in one or more pump stages, bearing issues, particulate matter, etc. As an example, a cable may carry current to power a multiphase electric motor or other piece of equipment (e.g. , downhole equipment powerable by a cable).

[0084] As mentioned, metallic lead (Pb) may give rise to manufacturing issues. For example, impurities of metallic lead (Pb) may lead to formation of intermetallic compounds that may make extrusion processes quite difficult. As an example, some failures may occur in the fields that may possibly be associated with stress cracking, crevice corrosion and/or cold creep of metallic lead (Pb) barriers (e.g., as failure modes). As an example, the high density of metallic lead (Pb) may add substantial weight to finished cable/MLE products, which can increase transportation cost, impact handling (e.g. , installation on a rig), etc. Use of metallic lead (Pb) may impact slack management (e.g. , e.g. , consider applications that involve coiled tubing).

[0085] As an example, a power cable can include a conductor and a lead (Pb) alloy tape wrapped about the conductor. As an example, a method for manufacturing a coated conductor for a power cable can include extruding an insulation layer over a conductor, longitudinally applying a lead (Pb) alloy tape over the insulation layer and sealing opposing edges of the lead (Pb) alloy tape. As an example, a method for manufacturing a power cable can include providing a plurality of coated conductors having an insulation layer and a lead (Pb) alloy tape layer, arranging the conductors, and applying an armor around the arranged coated conductors.

[0086] As an example, manufacture of an inline longitudinal wrapped gas impermeable barrier may include utilizing with a lead (Pb) alloy (e.g., Pb-Sn-Sb crystal structure) tape. As an example, an inline longitudinal wrapped gas impermeable barrier that includes a lead (Pb) alloy tape for gas sealing may be disposed about individual copper conductors within a multi-phase conductor assembly.

[0087] As an example, a method can include manufacturing an inline longitudinal wrapped gas impermeable barrier tape. In such an example, the manufacturing method can include conductor alignment, tape alignment and preformation, tape folding and overlap mating, additional sealing mechanisms introduced, light compaction of strand, and application of pressure and heat for duration sufficient to allow for the formation of a gas barrier. As an example, a lead (Pb) alloy barrier may be protected with cushioning material before continuing on with one or more subsequent operations of a manufacturing process.

[0088] Fig. 7 shows examples of cables 700 and 701 , which can be power cables. As shown, a conductor 710 may be formed from a raw conductor material (e.g., copper), that has been drawn to a standard wire size, annealed, and plated in either a stranded or solid configuration. As an example, the conductor 710 can be insulated with an EPDM or thermo-plastic insulation layer 730, which may be extruded and the subjected to one or more curing and/or post-curing processes. In the examples of Fig. 7, a lead (Pb) alloy tape 750 (e.g. , an AMALOY alloy (Pb-Sn-Sb crystal structure) tape) has been applied over each of the EPDM or thermo-plastic insulation layers 730. As shown, a cable jacket 770 can be applied over the lead (Pb) alloy tape 750. As an example, the cable jacket 770 may be an extruded thermoplastic layer, a foam layer, or other suitable material layer.

[0089] As an example, the cables 700 and 701 may include one or more additional layers and/or one or more additional features, for example, consider one or more layers, features, etc. described with respect to the cables 400 and 401 of Fig. 4, the MLE 500 of Fig. 5, the arrangements 610 and 630 of Fig. 6, etc.

[0090] As an example, in some round power cable embodiments, one or more individual coated conductors can be arranged and an EPDM jacket 770 extruded over the conductor(s) before application of one or more layers of armor 780 and 790. As an example, in some round cable embodiments, two or more individual coated conductors can be twisted together before an EPDM jacket is extruded over the twisted conductors. As an example, in some round cable embodiments, individual coated conductors can be braided together before an EPDM jacket is extruded over the braided conductors. As an example, in some round cable embodiments, a power cable can have three conductors, which may correspond to phases of a multiphase power cable that can supply multiphase power to equipment that can operate on multiphase power delivered via the multiphase power cable.

[0091] As an example, in some flat power cable embodiments, two or more individual coated conductors can be arranged in a side-by-side configuration (e.g., consider configurations such as 2x1 , 3x1 , 4x1 , etc.) and, for example, one or more armor layers can be applied over a jacket.

[0092] Fig. 8 shows an example of a method 800 for fabrication of a power cable. As shown in Fig. 8, the method 800 includes a provision block 810 for providing a conductor. For example, a conductor may be formed using a raw conductor material (e.g., copper) that has been drawn to standard wire sizes, annealed, and plated in either a stranded or solid configuration. As shown, the method 800 includes an insulation block 820 for insulating the conductor. For example, the conductor can be insulated with an EPDM or thermoplastic material applied via an extrusion process before being subjected to one or more post curing processes. As shown, the method 800 includes an application block 830 for applying tape. For example, a tape that includes a lead (Pb) alloy and adhesive can be applied to the insulated conductor (e.g., as formed via the insulation block 820).

[0093] In the example of Fig. 8, the method 800 can include an application block 840 for applying a tape jacket, which may, for example, be a material disposed about the tape that can provide some protection, support, etc. for the tape. As an example, the method 800 can include a configuration block 850 for configuring a plurality of covered conductors (e.g., made per the blocks 810, 820, 830 and optionally 840). As shown in Fig. 8, the method 800 can include an application block 860 for applying a jacket about a plurality of configured, covered conductors and, for example, the method 800 can include an application block 870 for applying one or more armor materials (e.g. , armor) about the jacket of the application block 860.

[0094] As an example, the tape jacket of the application block 840 may be a jacket formed by extruded material. For example, the tape jacket may be a thermoplastic material or a foam material. As an example, a covered conductor may be collected on one or more process reels, for example, via a take up and

accumulator system, which may be transported to a location for one or more operations. In such an example, the tape jacket may protect the lead (Pb) alloy tape and, for example, shrink tape from damage during one or more subsequent processes (e.g., twisting, armoring, etc.).

[0095] As to the configuration block 850, one or more covered, jacketed conductors can be configured to a desired shape (e.g. , round, flat, etc.). As an example, in some embodiments, an optional EPDM jacket may be extruded over the covered, jacketed conductors. And, for example, an armoring process can include applying one or more armor layers.

[0096] As an example, in some embodiments, the tape can include a lead (Pb) alloy that includes a Pb-Sn-Sb crystal structure where Pb is lead, Sn is tin and Sb is antimony. In such an example, a sealing mechanism with such tape can operate as a composite material. For example, consider a sealing mechanism as in cold welding to form a H2S and CO2 barrier suitable for use of an insulated conductor for downhole applications.

[0097] As an example, tape may be longitudinally wrapped along individual conductors with some amount of overlap. As an example, tape may be helically wound about individual conductors with some amount of overlap.

[0098] As an example, once geometry is loosely formed (e.g. , via one or more dies), a conductor assembly may be sent through a light roller compaction operation to remove trapped gas (e.g. , air, etc.) that may be present beneath tape.

[0099] As an example, in some embodiments, tape may be helically wrapped with a heat shrinkable tape (e.g., akin to PTFE) and, for example, with grounding wire (e.g. , as desired). As an example, helical taping may act as a composite reinforcement mechanism for the lead (Pb) alloy tape to provide additional strength and toughness for withstanding one or more types of downhole conditions. [00100] As an example, an assembly may then be passed through a heat tunnel to activate heat shrinkable material (e.g. , heat shrinkable tape, etc.) and provide sufficient temperature and/or pressure to cold weld and seal lead (Pb) alloy tape. In such an example, the lead (Pb) alloy tape can be a barrier that can be protected from damage, for example, damage due to being compressed between insulation and heat shrinkable material that can form a reinforced composite material.

[00101 ] As an example, a process for manufacturing a lead (Pb) alloy tape gas barrier may include several manufacturing subassemblies followed by a protective padding barrier (e.g., a tape jacket, etc.). As an example, in some embodiments, a lead (Pb) alloy tape may be secured inline of an insulated conductor with a pay-off system.

[00102] As an example, one or more manufacturing subassemblies may include one or more operations. For example, consider the one or more of the example operations listed below, which are referred to as first, second, third, fourth, fifth, sixth and seventh operations; noting that such numbering is for convenience of describing the operations, which may be performed in one or more orders.

[00103] As an example, a first operation can include utilizing a pre-forming die where an insulated conductor passes relatively loosely through the die. In such an example, the die geometry can be shaped to initiate one or more bends to form lead (Pb) alloy tape around an insulated conductor and, for example, to impart additive sealing, which may facilitate one or more other processes and/or provide for some amount of protection of the tape. As an example, a die may include a lazy "S" or "C" geometry with proper radii lead-ins. As an example, a geometry may be provided to support the tape during the pre-forming process (e.g. , to help prevent tearing, etc.).

[00104] As an example, a second operation can include utilizing a funneling die for enclosing the tape relatively loosely around insulated conductors. In such an example, the funneling die can feature a long lead-in geometry (e.g. , akin to a funnel) that can bring the pre-formed tape and insulated conductor together to make a first product subassembly. As an example, such an approach may be employed to close the geometry enough to allow for an orientation die to make finer adjustments.

[00105] As an example, a third operation can include utilizing a geometry orientation die that forms the lead (Pb) alloy tape to a desired geometry for one or more subsequent manufacturing processes. As an example, for a substantially "C" shaped geometry, an operation can provide for enclosing the tape around itself in a substantially "σ" shape (e.g., a lower case sigma shape) with an amount or amounts of overlap. As an example, for a substantially "S" shaped geometry, an operation can provide for forming half the "S" shape around the insulated conductor and overlapping to make a "δ" shape (e.g., a lower case delta shape). In such an example, the other half of the "S" shape may be left open for adding additional sealing.

[00106] As an example, a fourth operation can include utilizing an additive sealing die. In such an example, for the case of the aforementioned "σ" shape, such an operation may include utilization of an acid based flux, for example, to remove surface oxides in one or more areas of overlap; whereas, for the case of the aforementioned "δ" shape, such an operation may include addition of a core wire coated with acid based flux, for example, to remove surface oxides on one or more overlapping surfaces. In such an example, a core wire may be added using a narrow shiv and/or a guiding die (e.g. , into a subsequent operation).

[00107] As an example, a fifth operation can include utilizing a roller compaction die to form a product subassembly geometry, for example, to form a near round geometry of a product subassembly. For example, in the case of the added core wire design, stiffness of the core wire may be specified to be less than stiffness of the applied insulation to help reduce risk of damage. As an example, an operation may include compaction, for example, to the point of making contact between one or more tape layers and removing trapped gas (e.g., air, etc.).

[00108] As an example, a sixth operation can include shrink tape wrapping. As an example, a shrink tape wrapping operation can be performed to reinforce a lead (Pb) alloy tape, for example, by creating a composite material with one or more layers of the lead (Pb) alloy tape disposed between conductor insulation and shrink tape. As an example, helical wrapping may be performed in a manner that can provide additional flexibility of the tape layer (e.g. , without buckling the tape). As an example, helical wrapping may allow for additional hoop strength, which may be desirable for one or more subsequent operations. As an example, one or more parameters of a wrapping operation may be adjusted, for example, based at least in part on a processing line speed. For example, a long lay, wide helical taping technique may be utilized where one or more factors (e.g., width of the helical tape, overlap, etc.) may be adjusted. [00109] As an example, a seventh operation can include utilizing a heated tunnel for shrinking of shrink tape. In such an example, heat and pressure may be applied to fuse lead (Pb) alloy tape onto itself to create bond(s). As an example, a tunnel (e.g. , a tube) may include a controlled environment such as a gas controlled environment. For example, a nitrogen environment (e.g., low or no oxygen environment) may be utilized to reduce risk of surface oxidation at elevated temperatures. As an example, after heating, a H2S and CO2 composite reinforced barrier may be sufficiently formed at least in part via a lead (Pb) alloy tape. As an example, a ground wire may be added, for example, if desired to relieve capacitance of a lead (Pb) alloy tape.

[00110] Fig. 9 shows an example approximate ternary phase diagram 901 , an example approximate ternary melt diagram 903, an example of a lead (Pb) alloy tape 910, an example of a lead (Pb) alloy tape 950 and examples 905 and 907 of tape 910 or 950 being applied to an insulated conductor 990. In the examples of Fig. 9, the dimensions of materials of the tapes 910 and 950 may differ from those illustrated (e.g. , thicknesses may differ from those illustrated).

[00111 ] In the ternary phase diagram 901 , three regions R1 , R2 and R3 are labeled where the region R2 is a corridor (Pb + SbSn) characterized by a lead (Pb) plus SbSn crystal structure. As an example, a lead (Pb) alloy of a tape may be selected from region R2. In the ternary melt diagram 903, lead (Pb) at 100 percent by weight is shown in a lower left corner where increasing weight percent of antimony (Sb) is upwardly to the right and where increasing weight percent of tin (Sn) is horizontally to the right. The diagram 903 shows melting temperature contours which are generally increasing toward 100 percent by weight lead. As an example, a lead (Pb) alloy of a tape may be selected from the region shown in the diagram 903, for example, based at least in part on melting temperature. In such an example, the selected lead (Pb) alloy can be an alloy of region R2 of the ternary phase diagram 901 (noting that the ternary phase diagram is for about 109 degrees C). As an example, a lead (Pb) alloy can include lead (Pb), tin (Sn) and antimony (Sb) and can be about 10 percent by weight tin (Sn) or less and about 10 percent by weight or less antimony (Sb); with the remainder substantially lead (Pb) (e.g. , 80 percent by weight or more). As an example, a lead (Pb) alloy can include lead (Pb), tin (Sn) and antimony (Sb) and can be about 5 percent by weight tin (Sn) or less and about 5 percent by weight or less antimony (Sb); with the remainder substantially lead (Pb) (e.g. , 90 percent by weight or more). As an example, a lead (Pb) alloy can include lead (Pb), tin (Sn) and antimony (Sb) and can be about 4 percent by weight tin (Sn) or less and about 4 percent by weight or less antimony (Sb); with the remainder substantially lead (Pb) (e.g. , 92 percent by weight or more). As an example, a lead (Pb) alloy can include lead (Pb), tin (Sn) and antimony (Sb) and can be about 0.5 to about 3 percent by weight tin (Sn) and about 1.5 to about 5 percent by weight or less antimony (Sb); with the remainder substantially lead (Pb) (e.g. , about 92 to about 98 percent be weight).

[00112] As an example, a method can include selecting a composition for a lead (Pb) alloy from a ternary phase diagram such as, for example, the diagram 901 ; and/or selecting a composition for a lead (Pb) alloy from a ternary melt diagram such as, for example, the diagram 903. For example, a lead (Pb) alloy may be selected as to a phase structure (see, e.g., region R2) and as to a melt temperature for that phase structure. As an example, a melt temperature may be selected based on one or more factors. For example, operational temperature, process temperature for making a cable, etc. As an example, where a process includes applying heat to seal a tape wrapped about an extruded layer of insulation, a melt temperature may be selected with respect to the process, which may or may not include a material such as, for example, solder.

[00113] As mentioned, tape may be applied with an amount of overlap, whether via helical wrapping, longitudinal wrapping or other type of wrapping operation. As an example, a taping operation may be performed according to one or more parameters, which may include, for example, one or more helical or spiral parameters, one or more longitudinal parameters, etc. For example, tape may be wrapped at an angle to a longitudinal axis of an insulated conductor. As an example, tape may be applied longitudinally where rollers or other type of shapers form the tape about an insulated conductor.

[00114] As an example, a taping operation can include a pressure parameter, for example, associated with an amount of pressure applied to a pressure sensitive adhesive of the tape. As an example, a post-taping operation may apply pressure to tape wrapped about an insulated conductor. As an example, a heat shrink material may be applied and subjected to heat to apply pressure to a pressure sensitive adhesive of tape. [00115] As an example, a method may employ one or more processes associated with wrapping of tape that includes a lead (Pb) alloy. For example, consider one or more of: soldering and/or brazing where a solder melt temp can be less than that of a polymerization related process (e.g., less than a vulcanizing process temperature) such that the polymerization related process (e.g. , vulcanizing, post-curing insulation, etc.) can be of a temperature that is sufficient to braze seal the lead (Pb) alloy tape as a barrier for the insulation; an adhesive or adhesives; chemical reaction bonding where chemicals may react, which may be an exothermic reaction (e.g., consider aluminothermic types of reactions, etc.); heat welding where a sufficient high temperature can be utilized to melt lead, optionally of the lead (Pb) alloy tape (e.g. , consider short-pulse laser or other type of laser welding where heat may be delivered with a penetration depth that reduces heating of extruded insulation as may be indicated by a time-temperature profile); and cold welding where, for example, a relatively oxygen free environment may be utilized to reduce formation of one or more types of oxides (e.g., oxide layers). As an example, cold welding can be a solid-state welding process in which joining takes place without fusion/heating at the interface of the two parts to be welded as can occur in heat welding.

[00116] As an example, the tape 910 can include lead (Pb) alloy 920 and adhesive 930 and, for example, the tape 950 can include lead (Pb) alloy 960 and one or more other materials 970 and 980 where at least one of the one or more other materials 970 and 980 includes adhesive. In such examples, the lead (Pb) alloy 920 and/or 960 may be selected as described above with respect to the diagrams 901 and 903.

[00117] As an example, an adhesive can include be an acrylic adhesive.

Acrylic can refer to chemical compounds that include the acryloyi group, for example, as derived from acrylic acid.

[00118] As an example, an adhesive may be a nitrile adhesive (e.g. , nitrile, hydrogenated nitrile butadiene rubber (HNBR), etc.). As an example, an adhesive can include one or more additives. As an example, a tape can include one or more different types of adhesives (e.g. , HNBR and acrylic).

[00119] As an example, an adhesive can be a pressure-sensitive adhesive (PSA). A PSA can be a material that can hold surfaces together via surface contact, for example, upon contacting the surfaces. [00120] As an example, to form a PSA, one or more adhesive components, which can include acrylic, can be dissolved in a solvent and then coated onto a web. In such an example, the solvent can be evaporated to leave a sticky adhesive.

[00121 ] As an example, to form a PSA, an emulsion (e.g. , water-based) may be formed for dispersal of, for example, acrylic polymer and one or more additive. Such an emulsion may be coated onto a web where, for example, a liquid phase is evaporated.

[00122] As an example, to form a PSA, a hot-melt may be formed as a mixture, for example, consider a mixture of polymer, one or more tackifying resins and a hydrocarbon diluent that can be heated until flowable. In such an example, the hot- melt can be coated onto a web.

[00123] As an example, a PSA can be formed through use of a UV-curable material on a substrate where the UV-curable material is an adhesive that may be curable via exposure to a UV radiation.

[00124] As an example, an adhesive can be or include one or more adhesives marketed by the 3M Company (St. Paul, Minnesota). For example, consider one or more of the 3M™ High Temperature Acrylic Adhesive 100 family such as 941 , 965, 966, 9461 P, 9461 PC, and/or 9462P.

[00125] 3M™ Adhesive Transfer Tapes with 3M™ High Temperature Acrylic Adhesive 100 may withstand temperature exposure to about 232 degrees C (e.g., about 450 degrees F) for periods of time and/or solvent resistance. Such tapes may exhibit suitable shear values at elevated temperatures. Such taps may offer low outgassing properties.

[00126] As an example, a tape can include a layer of adhesive with an adhesive thickness that is of the order of a mil or more (e.g. , from about 0.02 mm to about 0.1 mm or more).

[00127] As an example, an adhesive can be of a density of the order of about 1 gram per cubic centimeter (e.g. , about 1 gram per milliliter).

[00128] As an example, a tape can be provided with a liner, which may be referred to as a tape liner. A tape liner can be provided as a removable layer that may act to protect adhesive until a desired time. As an example, a liner may be made of a film material, a paper material, etc. As an example, a film liner may be polyester (PE), high density polyethylene (HDP), etc. As an example, a paper liner may be a Densified Kraft (e.g. , DK, XL, etc.) or a Polycoated Kraft (e.g., PCK, EK, etc.).

[00129] As an example, where a tape may be utilized for a cable that finds use in a steam environment (e.g., consider a SAGD operation), such a tape may be disposed about electrical insulation of an electrical conductor via one or more techniques, technologies, etc., which may or may not include use of an acrylic adhesive. For example, consider welding and/or soldering of a tape, use of a nitrile- based adhesive, etc. Such approaches may be undertaken to reduce sensitivity of the tape to moisture (e.g., as disposed about insulation).

[00130] As an example, a tape may be a metal alloy tape. As to a lead (Pb) alloy, such an alloy can include one or more of tin (Sn) and antimony (Sb). As an example, such an alloy may be akin to a "type metal". As an example, such an alloy can include a lead (Pb) content by weight that is higher than that of various type metals. As an example, a lead (Pb) alloy may be of a lead (Pb) content by weight that is greater than approximately 70 percent, for example, consider a lead (Pb) content by weight that is greater than approximately 86 percent by weight.

[00131 ] A lead (Pb) alloy can be an alloy of lead, tin and antimony. As an example, as to type metals, proportions by weight percent can be found the range of about 50 percent to about 86 percent Pb, about 1 1 percent to about 30 percent Sb and about 3 percent to about 20 percent Sn.

[00132] As an example, a lead (Pb) alloy can include a weight percent of tin (Sn) divided by a weight percent of antimony (Sb) that is in a range from about 0.5 to about 2. As an example, a composition of a lead (Pb) alloy may be approximately that of a composition suitable for deposition on a copper conductor. For example, consider a lead (Pb) alloy with a composition of approximately 80 weight percent Pb (lead); approximately 12 weight percent Sn (tin); approximately 3 weight percent Sb (antimony); and approximately 5 weight percent Bi (bismuth). As an example, a lead (Pb) alloy can include tin, antimony and bismuth.

[00133] As an example, a tape can include an approximately 5 mil (e.g. , about 0.13 mm) thickness of a lead (Pb) alloy. As an example, a tape can include an approximately 5 mil (e.g., about 0.13 mm) thickness of a lead (Pb) alloy and an approximately 2 mil (e.g., about 0.05 mm) thickness of adhesive. As an example, a tape can include an approximately 5 mil (e.g., about 0.13 mm) thickness of a lead (Pb) alloy and two layers of adhesive where the two layers of adhesive may have thicknesses in a range of about 1 mil (e.g., about 0.025 mm) to about 3 mil (e.g. , about 0.076 mm), for example, a total adhesive thickness of approximately 2 mil (e.g., about 0.05 mm) to about 6 mil (e.g. , about 0.15 mm).

[00134] As an example, in a cable, overlap may exist in some regions, for example, due to an overlapping spiral (e.g. , helical) application of a tape. In such an example, in regions of overlap (e.g. , from about 1 percent area to about 100 percent area or a "double" overlap), a thickness of a lead (Pb) alloy may be of the order of approximately 10 mil (e.g., about 0.25 mm). As mentioned, an extruded metallic lead (Pb) layer may be found in a range of about 20 mil (e.g. , about 0.5 mm) to about 60 mil (e.g., about 1 .5 mm). With respect to various dimensions given above as to a lead (Pb) alloy tape, such a tape may be an alternative to an extruded metallic lead (Pb) layer of about 40 mil (e.g. , about 1 mm).

[00135] As an example, a conductor can be of a diameter of about 5 mm, with insulation of a thickness of about 2.5 mm, a total diameter may be about 10 mm. Where metallic lead (Pb) is extruded about the insulation, the thickness may be about 12 mm (e.g., a 1 mm thickness of metallic lead (Pb)). Where a lead (Pb) alloy tape is utilized rather than metallic lead (Pb), the diameter may be about 10.5 mm in overlap regions of the lead (Pb) alloy tape, which represents a reduction of about 1 .5 mm in diameter; whereas, where overlap is less than about 100 percent, a diameter may be about 10.25 mm, which represents a reduction of about 1.75 mm in diameter. Over the length of a cable, such a reduction in thickness and amount of lead (Pb) (e.g. , density of about 1 1 .3 grams per cubic centimeter), can reduce overall cable weight, which can also be a factor in selection of equipment, performance of operations, etc.

[00136] As an example, where metallic lead (Pb) is mentioned, it may be about 99 percent or more by weight lead (Pb). For example, an extruded metallic lead (Pb) layer can be about 99 percent lead (Pb) by weight. As an example, such an extruded layer may be 99.9 percent lead (Pb) by weight.

[00137] As an example, a lead (Pb) alloy can include a weight percent of lead (Pb) that can be in excess of about 86 percent. For example, consider such an alloy with a weight percent of about 90 percent or more or, for example, of about 95 percent or more. As an example, a lead (Pb) alloy can include a weight percent of tin (Sn) of about 15 percent or less. As an example, a lead (Pb) alloy can include a weight percent of antimony (Sb) of about 15 percent or less. As an example, a lead (Pb) alloy can include a weight percent of tin (Sn) divided by a weight percent of antimony (Sb) is in a range from about 0.5 to about 2.

[00138] As lead (Pb), it has a melting point of about 327 degrees C. Lead (Pb) tends to be soft, malleable and ductile but with relatively little tenacity. Tin (Sn) tends to promote fluidity of a molten alloy and makes an alloy, increasing resistance to wear. Tin (Sn) is harder, stiffer and tougher than lead. Antimony (Sb) melts at about 630 degrees C. Antimony (Sb) tends to be a highly crystalline metalloid, which provides hardness. Antimony (Sb) has a crystalline appearance while being both brittle and fusible. When alloyed with lead (Pb), antimony (Sb) can strengthen the alloy and, for example, improves casting detail.

[00139] As an example, a lead (Pb) alloy tape can include an acrylic adhesive rated to about 230 degrees C (e.g., about 450 degrees F). In such an example, the lead (Pb) alloy can include about 96 percent by weight lead (Pb), about 1 .5 percent tin (Sn) and about 2.5 percent by weight antimony (Sb).

[00140] Fig. 10 shows example plots of data for a lead (Pb) alloy tape 1010 and for a metallic lead (Pb) extruded layer 1030. The data correspond to an excerpt of about 170 hours from about 900 hours. The plots 1010 and 1030 show temperature inside a chamber, ambient temperature outside of the chamber, and pressure within a sample. In both plots 1010 and 1030, the pressure data follow a substantially straight line with respect to time and cycling, which demonstrates effectiveness as to inhibiting gas penetration during cycling between about 65 degrees C to about 204 degrees C (e.g. , about 150 degrees F to about 400 degrees F). In the example layers corresponding to the plots 1010 and 1030, a pressure differential was maintained from an exterior side to an interior side through the entire period of time (e.g., resulting in the substantially straight line).

[00141 ] Fig. 1 1 shows a photograph 1 100 of examples of covered conductors where lead (Pb) alloy tape is applied over insulation.

[00142] Fig. 12 shows examples of processing equipment 1205, 1207 and 1209. As shown, the processing equipment 1205 can include a reel 1210 that carries a conductor 121 1 , a first extruder 1213 fed with a first material 1212 that can be extruded about the conductor 121 1 , a second extruder 1215 fed with a second material 1214 that can be extruded about the first material 1212 and a tape dispenser 1220 that supplies tape 1220 that can be wrapped about the second material 1214. In such an example, wrapping may be helical (e.g. , spiral), longitudinal (see, e.g. , operation 1221 ) and/or another type of wrapping.

[00143] As shown in Fig. 12, the processing equipment 1207 includes various components of the processing equipment 1205; however, a single extruder 1217 is included that can co-extrude the first material 1212 and the second material 1214.

[00144] As shown in Fig. 12, the processing equipment 1209 includes various components of the processing equipment 1205 and 1207; however, a heater 1218 is disposed between the extruder 1217 (e.g., or the extruder 1215) and a point where tape is applied. For example, the heater 1218 may be supplied with heat energy that can polymerize (e.g., vulcanize, cure, etc.) one or more of the first material 1212 and the second material 1214, at least in part, prior to application of the tape 1222 about the second material 1214 (e.g., as vulcanized, partially vulcanized, polymerized, partially polymerized, cured, partially cured, etc.).

[00145] As an example, a manufacturing process can include extruding polymeric insulation and heating the insulation to about 230 degrees C (e.g., about 450 degrees F) for about several minutes for polymerization, curing, vulcanizing, etc.

[00146] As an example, heat loss or cooling may occur for extruded insulation prior to tape wrapping. For example, extruded insulation may cool approximately to an ambient temperature (e.g. , a room temperature of about 5 degrees C to about 40 degrees C).

[00147] As an example, a process can include post-curing, for example, after passing extruded insulation through a heater. As an example, tape wrapping can be performed before or after post-curing. As an example, tape wrapping may be performed at ambient temperature and/or at an elevate temperature. As an example, a temperature may be selected for tape wrapping where the temperature may promote adhesion of tape (e.g. , a lead (Pb) alloy tape) directly to polymeric electrical insulation (e.g., or indirectly to a tie layer of the polymeric electrical insulation).

[00148] As an example, where an adhesive is a high temperature adhesive, it may withstand temperatures associated with heating for polymerizing, curing, vulcanizing, etc. extruded insulation. In such an example, tape may be applied to extruded insulation before and/or after a heater (see, e.g., the heater 1218 of the processing equipment 1209 of Fig. 12). [00149] As an example, tape may be applied in a manner that acts to even out extruded polymeric insulation. For example, at some point after an extruder die, tape may be wrapped about the polymeric insulation in a manner that can smooth out imperfections in the polymeric insulation.

[00150] As an example, a polymerization process may be characterized at least in part by a curve such as, for example, a vulcanization curve, which can exhibit an increase in viscosity of polymeric material (e.g., insulation) during crosslinking. As an example, a steepness of a curve can be affected by the nature of one or more additives (e.g., accelerator(s), etc.). As an example, a method can include wrapping tape about insulation where the insulation may be at a point on a curve of viscosity versus time, which may, for example, correspond to a distance from a die of an extruder that extrudes the insulation. Such a method may allow for matching or tailoring force of applying tape with respect to properties of the extruded insulation (e.g., at a particular point in time along a viscosity curve, modulus curve,

polymerization curve, etc.). As an example, a curve may correspond to one or more material states of insulation (e.g., molten, crystallized, polymerized, etc.).

[00151 ] As an example, processing equipment can include inspection equipment that can inspect layers, etc. at one or more points. For example, inspection equipment may inspect an extruded polymeric insulation layer at point a distance from a die of an extruder.

[00152] As an example, a copper conductor can be coated with a relatively thin layer of a lead (Pb) alloy and a co-extrusion process can co-extrude a tie layer and insulation about the coated copper conductor. In such an example, a lead (Pb) alloy tape may be wrapped about the insulation, for example, directly or indirectly where another layer may exist about the insulation (e.g. , another tie layer, etc.).

[00153] As an example, a single extruder may be utilized, for example, with a single material. In such an example, the single material can be an insulation that electrically insulates a conductor. As an example, such insulation can be a polymeric material such as, for example, polypropylene (PP), PEEK, EPDM, etc. For example, a polymeric material such as one or more of PP, EPDM, PEEK, PFA, and/or epitaxial co-crystalline (ECC) perfluoropolymer (e.g. , DuPont™ ECCtreme® ECA 3000 fluoroplastic resin), may be used as a dielectric layer.

[00154] As an example, a power cable can include an insulated conductor; and a lead (Pb) alloy tape wrapped about the insulated conductor. As an example, lead (Pb) alloy tape may be longitudinally wrapped about an insulated conductor such that a first edge of the tape overlaps a second edge of the tape to form a seam and where the seam extends over a length of the insulated conductor.

[00155] As an example, a power cable can include a jacket layer about an exterior surface of a lead (Pb) alloy layer. For example, consider an armor layer about an exterior surface of the jacket layer.

[00156] As an example, a method for manufacturing a coated conductor for a power cable can include providing a conductor; extruding an insulation layer over the conductor; longitudinally applying a lead (Pb) alloy tape over the insulation layer; and sealing opposing overlapped edges of the tape. In such an example, the method can include extruding a jacket over the tape.

[00157] As an example, a method for manufacturing a power cable can include providing a plurality of coated conductors, where at least one coated conductor includes a conductor; an insulation layer about the conductor; and a lead (Pb) alloy tape layer about the insulation layer; arranging the plurality of coated conductors; and applying an armor about an exterior of the arranged coated conductors. In such an example, the tape can be longitudinally applied over the insulation layer such that opposing edges of the tape overlap one another forming a seam running along a length of the conductor.

[00158] Fig. 13 shows an example of a process 1310, an example of a composite 1330 and an example of a phase diagram 1380. In the example process 1310, a conductor 1312 includes a layer of insulation 1314 (e.g. , an extruded layer of insulation) where a lead (Pb) alloy tape 1316 is wrapped about the layer of insulation 1314 with a material 1318 such as, for example, solder. In the example process 1310, the material 1318 may be in the form of a rod that may, for example, be a substantially cylindrical rod or, for example, a rod with a flatter profile (e.g., consider cross-sectional profiles of spaghetti versus linguini). The process 1310 may proceed along one or more operations to seal the tap 1316 about the layer of insulation 1314. As an example, a method can include solder brazing before compaction using a die or dies. As an example, a material can be a solder filler rod that may sit on or proximate to an area of overlap such that the solder filler rod can will melt and flow to form a seal (e.g., between overlap of the tape).

[00159] As to the example composite 1330, it may be formed via a process that can include crosslinking a portion of adhesive of a tape to polymeric insulation, for example, during a curing process for the polymeric insulation, which may be extruded about a conductor. In such an example, an elastomer/metal composite may be formed. The example composite 1330 is illustrated as a polymeric insulation layer 1332 bonded to a tape 1334 that includes metallic material. As an example, such a composite may be formed via a metallic material layer coated with a resin or resins where the insulation includes a polymeric material that can bond to the resin or resins (e.g., consider a metallic tape that includes with a fluoropolymer resin, polyester, etc. and an insulation that includes one or more polymers, etc.).

[00160] As to the phase diagram 1380, it illustrates some types of solder compositions that may be utilized, for example, for a process such as the process 1310 or one or more other types of processes. As an example, for a SAGD environment or an environment similar to SAGD in terms of moisture and/or temperature, a soldering process for wrapped tape that includes a lead (Pb) alloy may include use of an approximately 95 weight percent Pb and approximately 5 weight percent Sn solder. As an example, consider one or more of the following solder compositions for one or more processes and/or environments: 70Pb/30Sn (e.g., an approximate 183 degree C melting temperature); 95Pb/5Sn (e.g. , for an approximate 312 degree C melting temperature; or 99.9Pb (e.g., for an

approximately 327 degree C melt temperature. As an example, a process may utilize a lead (Pb) and tin (Sn) solder mixture of approximately 70Pb/30Sn where a lower melting point is desired in a brazing process and a higher lead (Pb) content where a higher melting point is desired.

[00161 ] Fig. 14 shows an example of a geologic environment 1400 and a system 1410 positioned with respect to the geologic environment 1400. As shown, the geologic environment 1400 may include at least one bore 1402, which may include casing 1404 and well head equipment 1406, which may include a sealable fitting 1408 that may form a seal about a cable 1420. In the example of Fig. 14, the system 1410 may include a reel 1412 for deploying equipment 1425 via the cable 1420. As an example, the equipment 1425 may be a pump such as an ESP. As an example, the system 1410 may include a structure 1440 that may carry a

mechanism such as a gooseneck 1445 that may function to transition the cable 1420 from the reel 1412 to a downward direction for positioning in the bore 1402.

[00162] As an example, the cable 1420 may include one or more conductive wires, for example, to carry power, signals, etc. For example, one or more wires may operatively couple to the equipment 1425 for purposes of powering the equipment 1425 and optionally one or more sensors. As shown in the example of Fig. 14, a unit 1460 may include circuitry that may be electrically coupled to the equipment 1425. As an example, the cable 1420 may include or carry one or more wires and/or other communication equipment (e.g., fiber optics, rely circuitry, wireless circuitry, etc.) that may be operatively coupled to the equipment 1425. As an example, the unit 1460 may process information transmitted by one or more sensors, for example, as operatively coupled to or as part of the equipment 1425. As an example, the unit 1460 may include one or more controllers for controlling, for example, operation of one or more components of the system 1410 (e.g., the reel 1412, etc.). As an example, the unit 1460 may include circuitry to control

depth/distance of deployment of the equipment 1425.

[00163] In the example of Fig. 14, the weight of the equipment 1425 may be supported by the cable 1420. As an example, the cable 1420 may support the weight of the equipment 1425 and its own weight, for example, to deploy, position, retrieve the equipment 1425. As an example, a cable may be weight rated, for example, a cable that includes lead (Pb) alloy tape may be weight rated for weights of about one hundred kilograms to about several hundred kilograms, for example, as configured as in the arrangement 701 of Fig. 7 (see also, e.g., the arrangement 630 of Fig. 6).

[00164] In the example of Fig. 14, the cable 1420 may include a lead (Pb) alloy, for example, as a spiral layer or layers (e.g., helical layer or layers). In such examples, the use of the lead (Pb) alloy may reduce the weight of the cable 1420 compared to a cable that includes metallic lead (Pb), with a thickness greater than that of the lead (Pb) alloy layer or layers.

[00165] As an example, the cable 1420 may have a relatively smooth outer surface, which may be a polymeric surface. In such an example, the surface may facilitate deployment and/or sealability, for example, to form a seal about the cable 1420 (e.g., at a wellhead and/or at one or more other locations).

[00166] As an example, a polymer can be ethylene propylene diene monomer (M-class) rubber (EPDM). EPDM rubber is a terpolymer of ethylene, propylene, and a diene-component. As an example, ethylene content may be, for example, from about 40 percent to about 90 percent where, within such a range, a higher ethylene content may be beneficial for extrusion. [00167] As an example, a power cable can include a conductor; insulation disposed about the conductor; and a lead (Pb) alloy tape wrapped about the insulation. In such an example, the power cable can include a heat weld that forms a seal with respect to the lead (Pb) alloy tape.

[00168] As an example, a power cable can include a conductor; insulation disposed about the conductor; and a lead (Pb) alloy tape wrapped about the insulation. In such an example, the power cable can include a cold weld that forms a seal with respect to the lead (Pb) alloy tape.

[00169] As an example, a power cable can include a conductor; insulation disposed about the conductor; and a lead (Pb) alloy tape wrapped about the insulation. In such an example, the power cable can include solder that forms a seal with respect to the lead (Pb) alloy tape.

[00170] As an example, a power cable can include a conductor; insulation disposed about the conductor; and a lead (Pb) alloy tape wrapped about the insulation. In such an example, the power cable can include one or more of a heat weld, a cold weld, chemical weld, solder and adhesive. As an example, a heat weld can include, for example, a weld formed by laser welding, which can act to locally increase temperature of one or more materials to form the heat weld. As an example, a heat welding operation may be part of an inline process that forms a lead (Pb) alloy layer about an insulated conductor.

[00171 ] As an example, a power cable can include a conductor; insulation disposed about the conductor; and a lead (Pb) alloy tape wrapped about the insulation. In such an example, the lead (Pb) alloy tape can include adhesive, which can be, for example, pressure sensitive adhesive. As an example, adhesive can be or include acrylic adhesive.

[00172] As an example, a lead (Pb) alloy tape can include an adhesive layer that has a thickness of less than approximately 0.2 mm or, for example, a thickness of less than approximately 0.1 mm.

[00173] As an example, a lead (Pb) alloy tape can include a single adhesive layer adjacent to a lead (Pb) alloy layer. As an example, a lead (Pb) alloy tape can include two adhesive layers and a lead (Pb) alloy disposed between the two adhesive layers. [00174] As an example, a power cable can include a lead (Pb) alloy tape that includes a lead (Pb) alloy layer that has a thickness of less than approximately 0.3 mm or, for example, a thickness of less than approximately 0.15 mm.

[00175] As an example, a power cable can include a lead (Pb) alloy tape that includes a lead (Pb) alloy layer that includes a lead (Pb) alloy that includes tin (Sn) and/or antimony (Sb).

[00176] As an example, a power cable can include a lead (Pb) alloy tape that includes longitudinally wrapped lead (Pb) alloy tape and/or spirally wrapped lead (Pb) alloy tape (e.g., helically wrapped).

[00177] As an example, a power cable can include an insulated conductor where the insulation includes a polymeric insulation. For example, consider a polymeric insulation that includes ethylene propylene diene monomer (M-class) rubber (EPDM).

[00178] As an example, a power cable can include a lead (Pb) alloy tape that contacts insulation disposed about a conductor. In such an example, the contact can be direct contact. For example, the insulation can be extruded insulation where the tape directly contacts an exterior surface of the extruded insulation. Such an arrangement may be formed by wrapping the tape about the extruded insulation at a distance from a die of an extruder that extrudes the insulation about a conductor.

[00179] As an example, a method can include extruding an electrical insulation layer over an electrical conductor; and wrapping a lead (Pb) alloy tape over the electrical insulation layer. In such an example, the wrapping can be longitudinal wrapping. As an example, wrapping may be spiral wrapping (e.g. , helical wrapping). In such an example, the method may be utilized as part of a process to make a power cable that includes one or more conductors with insulation disposed each of the one or more conductors and a lead (Pb) alloy tape wrapped about the insulation of each of the one or more conductors.

[00180] As an example, an electric submersible pump power cable can include a plurality of insulated conductors where each of the insulated conductors includes lead (Pb) alloy tape wrapped thereabout (e.g., wrapped about lengthwise). As an example, an insulated conductor with a lead (Pb) alloy tape wrapped thereabout may be terminated at its ends such that an electrical connection can be made to the conductor of the insulated conductor with the tape wrapped thereabout. [00181 ] As an example, one or more methods described herein may include associated computer-readable storage media (CRM) blocks. Such blocks can include instructions suitable for execution by one or more processors (or cores) to instruct a computing device or system to perform one or more actions.

[00182] According to an embodiment, one or more computer-readable media may include computer-executable instructions to instruct a computing system to output information for controlling a process. For example, such instructions may provide for output to sensing process, an injection process, drilling process, an extraction process, an application process, an extrusion process, a curing process, a tape forming process, a pumping process, a heating process, etc.

[00183] Fig. 15 shows components of a computing system 1500 and a networked system 1510. The system 1500 includes one or more processors 1502, memory and/or storage components 1504, one or more input and/or output devices 1506 and a bus 1508. According to an embodiment, instructions may be stored in one or more computer-readable media (e.g., memory/storage components 1504). Such instructions may be read by one or more processors (e.g., the processor(s) 1502) via a communication bus (e.g., the bus 1508), which may be wired or wireless. The one or more processors may execute such instructions to implement (wholly or in part) one or more attributes (e.g. , as part of a method). A user may view output from and interact with a process via an I/O device (e.g., the device 1506). According to an embodiment, a computer-readable medium may be a storage component such as a physical memory storage device, for example, a chip, a chip on a package, a memory card, etc.

[00184] According to an embodiment, components may be distributed, such as in the network system 1510. The network system 1510 includes components 1522- 1 , 1522-2, 1522-3, . . . 1522-N. For example, the components 1522-1 may include the processor(s) 1502 while the component(s) 1522-3 may include memory accessible by the processor(s) 1502. Further, the component(s) 1522-2 may include an I/O device for display and optionally interaction with a method. The network may be or include the Internet, an intranet, a cellular network, a satellite network, etc.

[00185] Although only a few examples have been described in detail above, those skilled in the art will readily appreciate that many modifications are possible in the examples. Accordingly, all such modifications are intended to be included within the scope of this disclosure as defined in the following claims. In the claims, means- plus-function clauses are intended to cover the structures described herein as performing the recited function and not only structural equivalents, but also equivalent structures. Thus, although a nail and a screw may not be structural equivalents in that a nail employs a cylindrical surface to secure wooden parts together, whereas a screw employs a helical surface, in the environment of fastening wooden parts, a nail and a screw may be equivalent structures. It is the express intention of the applicant not to invoke 35 U.S. C. § 1 12, paragraph 6 for any limitations of any of the claims herein, except for those in which the claim expressly uses the words "means for" together with an associated function.