Title:
LEAD FRAME DEVICE WITH VENTED DIE FLAG
Document Type and Number:
WIPO Patent Application WO2005000568
Kind Code:
A3
Abstract:
A molded plastic semiconductor package (10) having reduced sensitivity to moisture level includes a die paddle (22) having at least one aperture (26) extending therethrough. A semiconductor die (30) is bonded to a first surface (32) of the die paddle (22) and spans the aperture (26). Once the semiconductor die (30) is electrically interconnected to an array of lead pads (24), the molding resin (42) encapsulates the semiconductor die (30) and first sides (32) of the die paddle (22) and array of lead pads (24). Opposing second sides of the die paddle (22) and array of lead pads (24) are exposed through a package surface in a QFN (Quad Flat No lead) configuration. The egress of moisture absorbed by the package (10) is facilitated by way of the aperture (26).
Inventors:
JUSKEY FRANK J (US)
PHIPPS GREGORY J (US)
LAU DANIEL K (US)
PHIPPS GREGORY J (US)
LAU DANIEL K (US)
Application Number:
PCT/US2004/019636
Publication Date:
April 14, 2005
Filing Date:
June 16, 2004
Export Citation:
Assignee:
ADVANCED INTERCONNECT TECH LTD (MU)
JUSKEY FRANK J (US)
PHIPPS GREGORY J (US)
LAU DANIEL K (US)
JUSKEY FRANK J (US)
PHIPPS GREGORY J (US)
LAU DANIEL K (US)
International Classes:
H01L21/44; H01L21/48; H01L21/50; H01L23/495; H01R43/00; B29D; (IPC1-7): H01L23/495; H01L21/44; H01L21/48; H01L21/50; H01R43/00
Foreign References:
| US4951122A | 1990-08-21 | |||
| JPH047850A | 1992-01-13 | |||
| US20040099931A1 | 2004-05-27 | |||
| US20040201081A1 | 2004-10-14 | |||
| US20010020734A1 | 2001-09-13 |
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