Title:
LEAD FRAME AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/033126
Kind Code:
A1
Abstract:
A lead frame (100) comprises a plurality of lead parts (110). Side wall surfaces of the lead parts (110) and at least a portion of the upper surfaces of the lead parts (110) are rough surfaces having been roughened. In a CIELab color space in the rough surfaces, an a* value is in the range of 12-19, and a b* value is in the range of 12-17.
Inventors:
NAGATA MASAHIRO (JP)
SHINOZAKI KAZUHIRO (JP)
YAMADA MASAHIRO (JP)
OKUYAMA DAISUKE (JP)
HATSUTA CHIAKI (JP)
SEKI KENTAROU (JP)
MATSUI HIDETO (JP)
OOUCHI KAZUNORI (JP)
SHINOZAKI KAZUHIRO (JP)
YAMADA MASAHIRO (JP)
OKUYAMA DAISUKE (JP)
HATSUTA CHIAKI (JP)
SEKI KENTAROU (JP)
MATSUI HIDETO (JP)
OOUCHI KAZUNORI (JP)
Application Number:
PCT/JP2022/033037
Publication Date:
March 09, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01L23/50; H01L21/60
Foreign References:
| JP2017168871A | 2017-09-21 | |||
| JP2020167207A | 2020-10-08 | |||
| JP2017022267A | 2017-01-26 | |||
| JP2007287765A | 2007-11-01 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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