Title:
LEAD FRAME MATERIAL AND METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/286697
Kind Code:
A1
Abstract:
The present invention provides: a lead frame material which exhibits excellent adhesion to a resin even in the cases where the lead frame material is used in a high-temperature high-humidity environment for a long period of time, and which is not susceptible to the occurrence of particle fall-off; a method for producing this lead frame material; and a semiconductor package which uses this lead frame material. A lead frame material 1 according to the present invention comprises a conductive base material 10 and a surface coating film 30 that is formed on at least a part of the surface of the base material 10; the surface coating film 30 comprises at least one roughened layer 3; and the space volume (Vv) and the protrusion entity volume (Vmp) as determined by measuring the surface properties of the surface coating film with use of a laser roughness meter are within the range of 0.6 cm3/m2 to 5.1 cm3/m2 and the range of 0.02 cm3/m2 to 0.30 cm3/m2, respectively.
Inventors:
KUZUHARA SOKI (JP)
HASHIMOTO MAKOTO (JP)
OOUCHI KAZUHIRO (JP)
HASHIMOTO MAKOTO (JP)
OOUCHI KAZUHIRO (JP)
Application Number:
PCT/JP2022/027047
Publication Date:
January 19, 2023
Filing Date:
July 08, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA PREC ENGINEERING CO LTD (JP)
FURUKAWA PREC ENGINEERING CO LTD (JP)
International Classes:
C25D5/10; C25D5/12; C25D5/16; C25D7/00; H01L23/48
Domestic Patent References:
| WO2017179447A1 | 2017-10-19 | |||
| WO2017077903A1 | 2017-05-11 | |||
| WO2018123708A1 | 2018-07-05 |
Foreign References:
| JPH10265991A | 1998-10-06 |
Attorney, Agent or Firm:
KURUMA Kiyoshi et al. (JP)
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