LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

Title:

LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2011/004711

Kind Code:

A1

Abstract:

Provided is a lead frame for an optical semiconductor device, comprising a conductive base (1) on which has been formed a layer (2) comprising silver or a silver alloy, wherein an outer layer of the layer comprising the silver or silver alloy comprises a metal-oxide layer (3) of a metal other than silver, the metal-oxide layer (3) is colorless and transparent or takes on a silver-white color, and the thickness is at least 0.001 μm and at most 0.2 μm. Also provided are a manufacturing method for the same, and optical semiconductor device using the same.

Inventors:

KOBAYASHI YOSHIAKI (JP)
KOSEKI KAZUHIRO (JP)
KIKUCHI SHIN (JP)

Application Number:

PCT/JP2010/060672

Publication Date:

January 13, 2011

Filing Date:

June 23, 2010

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)
KOBAYASHI YOSHIAKI (JP)
KOSEKI KAZUHIRO (JP)
KIKUCHI SHIN (JP)

International Classes:

H01L33/62; H01L33/60

Foreign References:

JP2009135355A	2009-06-18
JP2008072013A	2008-03-27
JP2008192635A	2008-08-21
JPS61148883A	1986-07-07
JP2008016674A	2008-01-24
JP2005129970A	2005-05-19
JP2009164132A	2009-07-23
JP2010131605A	2010-06-17

Other References: