Title:
LEAD FRAME AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2013/001905
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a lead frame and a power module with a high material yield.
The lead frame includes: multiple first leads that extend on one side of a region where a semiconductor element is provided in a plan view; multiple second leads that extend on the other side opposite to the one side of the region where the semiconductor element is provided in the plan view; a third lead that is provided on the outer side of the first lead positioned at one end of the multiple first leads in the plan view; and a wiring section that is connected to the third lead, constitutes a portion of a guide frame for the first leads, second leads, and third lead, and is used as wiring to be connected to the third lead after portions of the guide frame excluding the above-mentioned portion are removed.
Inventors:
KADOGUCHI TAKUYA (JP)
MIYOSHI TATSUYA (JP)
KAWASHIMA TAKANORI (JP)
OKUMURA TOMOMI (JP)
MIYOSHI TATSUYA (JP)
KAWASHIMA TAKANORI (JP)
OKUMURA TOMOMI (JP)
Application Number:
PCT/JP2012/061272
Publication Date:
January 03, 2013
Filing Date:
April 26, 2012
Export Citation:
Assignee:
TOYOTA MOTOR CO LTD (JP)
DENSO CORP (JP)
KADOGUCHI TAKUYA (JP)
MIYOSHI TATSUYA (JP)
KAWASHIMA TAKANORI (JP)
OKUMURA TOMOMI (JP)
DENSO CORP (JP)
KADOGUCHI TAKUYA (JP)
MIYOSHI TATSUYA (JP)
KAWASHIMA TAKANORI (JP)
OKUMURA TOMOMI (JP)
International Classes:
H01L23/50; H01L23/48; H01L25/07; H01L25/18
Foreign References:
| JP2001284518A | 2001-10-12 | |||
| JPH03280562A | 1991-12-11 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
Tadashige Ito (JP)
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Claims: