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Patent Searching and Data


Title:
LEAD FRAME PROCESSING COINING PUNCH, METHOD OF MANUFACTURING THE COINING PUNCH, AND LEAD FRAME
Document Type and Number:
WIPO Patent Application WO/2004/016368
Kind Code:
A1
Abstract:
A lead frame processing coining punch for processing a recessed groove in the surface of a lead frame, comprising a punch core part (2) having a punch tip part in contact with the surface of the lead frame at the time of processing and a hollow punch body part (3) having a coining processing part (9) for forming the recessed groove in the lead frame at the time of processing and a hollow part (10) in the axial direction of the punch, wherein the punch core part (2) is inserted into the hollow part (10) of the hollow punch body part (3), whereby even if the recessed groove is formed deep and narrow, the lead frame can withstand the processing without cracking.

Inventors:
Sakae, Akira c/o Kobe Corporate Research Laboratories in KABUSHIKI KAISHA KOBE SEIKO SHO (5-5 Takatsukadai 1-chome, Nishi-k, Kobe-shi Hyogo, 651-2271, JP)
Application Number:
PCT/JP2003/009976
Publication Date:
February 26, 2004
Filing Date:
August 06, 2003
Export Citation:
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Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO (10-26, Wakinohamacho 2-chome Chuo-k, Kobe-shi Hyogo, 651-8585, JP)
Sakae, Akira c/o Kobe Corporate Research Laboratories in KABUSHIKI KAISHA KOBE SEIKO SHO (5-5 Takatsukadai 1-chome, Nishi-k, Kobe-shi Hyogo, 651-2271, JP)
International Classes:
B21D22/02; B21D37/02; B21D37/20; H01L21/00; H01L21/48; H01L23/50; (IPC1-7): B21D22/02; B21D22/04; B21D24/00; B21D37/02; B21J5/02; B21J13/02; H01L23/50
Foreign References:
JPS61190330U
JP2002143976A
JPH1133635A
JPH01306031A
JP2001246425A
US5192560A
JPH0621317A
JPH05211269A
JPH01125941A
Attorney, Agent or Firm:
Kotani, Etsuji (Nichimen Building 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-k, Osaka-shi Osaka, 530-0005, JP)
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