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Title:
LEAD FRAME, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026917
Kind Code:
A1
Abstract:
This lead frame is provided with: a die pad; a plurality of long lead parts and a plurality of short lead parts, which are arranged around the die pad; and a connection bar to which the plurality of long lead parts and the plurality of short lead parts are connected. The long lead parts and the short lead parts are alternately arranged in the longitudinal direction of the connection bar. Long lead connection portions of the connection bar, to which the long lead parts are connected, are at least partially thinned from the back surface side; and short lead connection portions of the connection bar, to which the short lead parts are connected, are at least partially thinned from the front surface side.

Inventors:
OONUKI Masao (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
YAMAZAKI Tsuyoshi (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
OOUCHI Kazunori (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
YAZAKI Masaki (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
NAGATA Masahiro (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-k, Tokyo 01, 〒1628001, JP)
Application Number:
JP2018/028701
Publication Date:
February 07, 2019
Filing Date:
July 31, 2018
Export Citation:
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Assignee:
DAI NIPPON PRINTING CO., LTD. (1-1 Ichigaya-kaga-cho 1-chome, Shinjuku-ku Tokyo, 01, 〒1628001, JP)
International Classes:
H01L23/50; B21B1/22; B21B3/00; H01L21/52
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (Kyowa Patent & Law Office, Nippon Life Marunouchi Building1-6-6, Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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