Title:
LEAD FRAME STRUCTURE WITH APERTURE OR GROOVE FOR FLIP CHIP IN A LEADED MOLDED PACKAGE
Document Type and Number:
WIPO Patent Application WO2004093128
Kind Code:
A3
Abstract:
A semiconductor die package (100) is disclosed. In one embodiment, the die package includes a semiconductor die (118) including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads (106a-g) extending away from the die attach region. The die attach region (104) includes one or more apertures (130). A molding material (160) is around at least portions of the die attach region of the leadframe structure and the semiconductor die. The molding material is also within the one or more apertures.
Inventors:
JOSHI RAJEEV (US)
WU CHUNG-LIN (US)
WU CHUNG-LIN (US)
Application Number:
PCT/US2004/010249
Publication Date:
August 03, 2006
Filing Date:
April 01, 2004
Export Citation:
Assignee:
FAIRCHILD SEMICONDUCTOR (US)
JOSHI RAJEEV (US)
WU CHUNG-LIN (US)
JOSHI RAJEEV (US)
WU CHUNG-LIN (US)
International Classes:
H01L23/495; H01L21/60
Foreign References:
| US6329706B1 | 2001-12-11 | |||
| US5920116A | 1999-07-06 |
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