Title:
LEAD FRAME WITH RESIN AND MANUFACTURING METHOD FOR SAME, LED PACKAGE AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2017/056321
Kind Code:
A1
Abstract:
A lead frame with resin 30 according to the present invention comprises a lead frame 10 having a die pad 25 and a lead part 26 provided apart from the die pad 25 and a reflective resin 23 that is provided to surround the periphery of the die pad 25 and the lead portion 26 and that is integrated with the lead frame 10. Outer lead portions 27, 28 are formed in the die pad 25 and the lead part 26. In the reflective resin 23, a plurality of protrusions 47 is formed in the surface side of the lead frame 10 on which the outer lead portions 27, 28 are formed.
Inventors:
ODA KAZUNORI (JP)
SHINOMOTO MAKOTO (JP)
KAIDA YASUHIRO (JP)
KAWAI KENZABURO (JP)
NISHIYAMA JIN (JP)
UCHIYA NAOYUKI (JP)
IMAI KEIGO (JP)
SHINOMOTO MAKOTO (JP)
KAIDA YASUHIRO (JP)
KAWAI KENZABURO (JP)
NISHIYAMA JIN (JP)
UCHIYA NAOYUKI (JP)
IMAI KEIGO (JP)
Application Number:
PCT/JP2015/078093
Publication Date:
April 06, 2017
Filing Date:
October 02, 2015
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01L33/48
Domestic Patent References:
| WO2012102266A1 | 2012-08-02 |
Foreign References:
| US20110291152A1 | 2011-12-01 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
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