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Patent Searching and Data


Title:
LEAD FRAME
Document Type and Number:
WIPO Patent Application WO/2019/077874
Kind Code:
A1
Abstract:
In this invention, a lead frame sealed in a sealing resin body comprises: a plurality of islands (611 to 614) wherein a plurality of switching elements (70) are disposed individually; wirings (62, 620 to 623), each connected via a bridge member (90) to the corresponding switching element and separate from the island whereon the corresponding switching element is disposed; a plurality of exterior connection terminals having a plurality of main terminals (63) and a plurality of signal terminals (64); and tie-bars (66, 660a, 660b, 661a, 661b) linking the plurality of the exterior connection terminals to one another while being linked to at least one of the islands and the wirings. The extending direction of each of the tie-bars is parallel to the alignment direction of the intended positions of the corresponding bridge member, which are the position section (60a) of the bridge member in the corresponding island and the position section (60b) of the bridge member on the corresponding wiring.

Inventors:
NISHIHATA MASAYOSHI (JP)
YOSHIMIZU TAKASHI (JP)
TAKAISHI JUNPEI (JP)
RIKITA RYUNOSUKE (JP)
Application Number:
PCT/JP2018/031122
Publication Date:
April 25, 2019
Filing Date:
August 23, 2018
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L23/48; H01L21/60; H02M7/48
Domestic Patent References:
WO2014174573A12014-10-30
Foreign References:
JP2013179744A2013-09-09
JPH0575001A1993-03-26
JPH053275A1993-01-08
JP2009111154A2009-05-21
JP2009129952A2009-06-11
Attorney, Agent or Firm:
JIN Shunji (JP)
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