Title:
LEAD-FREE COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2011/155521
Kind Code:
A1
Abstract:
Disclosed is a lead-free composite (1) which is obtained by uniformly dispersing fine Sn-In-Bi alloy particles (3) in a poly(normal butyl acrylate) (2). The Sn-In-Bi alloy contains 57.50% by weight of Bi, 25.20% by weight of In and 17.30% by weight of Sn.
Inventors:
KATO, Yoshihisa (5-14-15, Ogami, Ayase-sh, Kanagawa 04, 〒2521104, JP)
Application Number:
JP2011/063124
Publication Date:
December 15, 2011
Filing Date:
June 08, 2011
Export Citation:
Assignee:
MEIKO ELECTRONICS CO., LTD. (5-14-15, Ogami Ayase-sh, Kanagawa 04, 〒2521104, JP)
株式会社メイコー (〒04 神奈川県綾瀬市大上５丁目１４番１５号 Kanagawa, 〒2521104, JP)
株式会社メイコー (〒04 神奈川県綾瀬市大上５丁目１４番１５号 Kanagawa, 〒2521104, JP)
International Classes:
B23K35/363; B23K35/14; B23K35/26; B82Y30/00; C22C12/00; H05K3/34; B23K35/40
Attorney, Agent or Firm:
NAGATO, Kanji (5F Hyakuraku Bldg, 8-1 Shinbashi 5-chome, Minato-k, Tokyo 04, 〒1050004, JP)
Claims:
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