Title:
LEAD-FREE COPPER ALLOY SLIDING MATERIAL
Document Type and Number:
WIPO Patent Application WO2008018348
Kind Code:
A9
Abstract:
Cu-Sn-Bi/hard-particle type sliding materials have a drawback that the copper of the copper matrix flows during sliding to coat the bismuth phase therewith, resulting in a decrease in seizing resistance with time. A lead-free sliding material is provided which has a structure preventing such problem. The sliding material has a composition containing 1-15% Sn, 1-15% Bi, and 1-10% hard particles having an average particle diameter of 5-70 µm, the remainder being copper and incidental impurities. (2) It has a structure comprising a copper matrix and, dispersed therein, a bismuth phase and the hard particles, all the hard particles having been bonded to the copper matrix.
Inventors:
YOKOTA HIROMI (JP)
YOSHITOME DAISUKE (JP)
YOSHITOME DAISUKE (JP)
Application Number:
PCT/JP2007/065125
Publication Date:
June 12, 2008
Filing Date:
August 02, 2007
Export Citation:
Assignee:
TAIHO KOGYO CO LTD (JP)
YOKOTA HIROMI (JP)
YOSHITOME DAISUKE (JP)
YOKOTA HIROMI (JP)
YOSHITOME DAISUKE (JP)
International Classes:
C22C32/00; B22F5/00; C22C1/05; C22C9/00; C22C9/02; F16C33/12
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