Title:
LEAD-FREE LOW-MELTING-POINT GLASS PASTE FOR INSULATION COATING
Document Type and Number:
WIPO Patent Application WO/2011/081022
Kind Code:
A1
Abstract:
Provided is a lead-free low-melting-point glass paste for insulation coating which contains an organic component as an essential component. The glass paste contains 95 to 50 mass% of a glass frit which contains 0 to 7 mass% of SiO2, 10 to 20 mass% of B2O3, 7 to 30 mass% of ZnO, and 35 to 80 mass% of Bi2O3.
Inventors:
TOMINAGA KOUJI
HAMADA JUN
HAMADA JUN
Application Number:
PCT/JP2010/072613
Publication Date:
July 07, 2011
Filing Date:
December 16, 2010
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
TOMINAGA KOUJI
HAMADA JUN
TOMINAGA KOUJI
HAMADA JUN
International Classes:
C03C8/16; H01B3/08; H01L31/04; H01M14/00
Foreign References:
| JP2009120462A | 2009-06-04 | |||
| JP2009046380A | 2009-03-05 |
Attorney, Agent or Firm:
HASHIMOTO, Takeshi et al. (JP)
Hashimoto 剛 (JP)
Hashimoto 剛 (JP)
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