Title:
LEAD-FREE LOW MELTING POINT GLASS COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/002120
Kind Code:
A1
Abstract:
Disclosed is a low melting point glass composition which contains virtually no lead components and contains, in terms of mass%, 0-8% SiO2, 2-12% B2O3, 2-7% ZnO, 0.5-3% RO (MgO+CaO+SrO+BaO), 0.5-5% CuO, 80-90% Bi2O3, 0.1-3% Fe2O3, and 0.1-3% Al2O3. The disclosed glass composition is stable and does not tend to crystallise under high temperatures, and thus can be used as a sealing material or insulating coating material for electronic substrates.
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Inventors:
HAMADA, Jun (())
Application Number:
JP2011/063198
Publication Date:
January 05, 2012
Filing Date:
June 09, 2011
Export Citation:
Assignee:
CENTRAL GLASS COMPANY, LIMITED (5253, Oaza Okiube Ube-sh, Yamaguchi 01, 〒7550001, JP)
セントラル硝子株式会社 (〒01 山口県宇部市大字沖宇部５２５３番地 Yamaguchi, 〒7550001, JP)
セントラル硝子株式会社 (〒01 山口県宇部市大字沖宇部５２５３番地 Yamaguchi, 〒7550001, JP)
International Classes:
C03C3/066; C03C3/145; C03C8/24; H01J9/02
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (Ekisaikai Bldg.1-29, Akashi-ch, Chuo-ku Tokyo 44, 〒1040044, JP)
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Claims: