LEAD-FREE SOLDER ALLOY, SOLDER JOINING MATERIAL, ELECTRONIC CIRCUIT MOUNTING BOARD, AND ELECTRONIC CONTROL DEVICE

Title:

LEAD-FREE SOLDER ALLOY, SOLDER JOINING MATERIAL, ELECTRONIC CIRCUIT MOUNTING BOARD, AND ELECTRONIC CONTROL DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/137535

Kind Code:

A1

Abstract:

In order to make it possible to achieve thermal fatigue resistance even in environments having extremely severe differences in temperature such as between -40ºC and 175ºC and minimize the development of cracks occurring in a solder joint section even in harsh environments in which such extremely severe differences in temperature and vibration are applied, the present invention provides a lead-free solder alloy characterized by comprising 2.0-4.0 mass% of Ag, 0.3-0.7 mass% of Cu, 1.2-2.0 mass% of Bi, 0.5-2.1 mass% of In, 3.0-4.0 mass% of Sb, 0.001-0.05 mass% of Ni, 0.001-0.01 mass% of Co, and a remainder of Sn.

Inventors:

MUNEKAWA YURIKA (JP)
NAKANO TAKESHI (JP)
ARAI MASAYA (JP)
SHIMAZAKI TAKANORI (JP)
KATSUYAMA TSUKASA (JP)

Application Number:

PCT/JP2019/048406

Publication Date:

July 02, 2020

Filing Date:

December 11, 2019

Export Citation:

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Assignee:

TAMURA SEISAKUSHO KK (JP)

International Classes:

B23K35/26; B23K35/363; C22C13/00; C22C13/02; H05K3/34

Domestic Patent References:

WO2017164194A1	2017-09-28
WO2012056753A1	2012-05-03
WO2018067426A1	2018-04-12
WO2017154957A1	2017-09-14

Foreign References:

JP2018518368A	2018-07-12
JP3027441B2	2000-04-04
JP3353662B2	2002-12-03

Other References: