Title:
LEAD-FREE SOLDER ALLOY AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/075788
Kind Code:
A1
Abstract:
A semiconductor device (20) which comprises: a semiconductor chip (1); a member to be connected (5) which is connected to the semiconductor chip (1) with a solder alloy (lead-free solder alloy) (2) being interposed therebetween; and an external terminal which is electrically connected to the semiconductor chip (1). The solder alloy (2) in the semiconductor device (20) is composed of 5-10% by weight of Cu, from 1% by weight to 4% by weight (inclusive) of Bi, and 1% by weight or more but less than 10% by weight of Sb and/or from 1% by weight to 4% by weight (inclusive) of In, with the balance made up of Sn.
Inventors:
MIYAZAKI TAKAAKI (JP)
IKEDA OSAMU (JP)
IKEDA OSAMU (JP)
Application Number:
PCT/JP2013/081275
Publication Date:
May 28, 2015
Filing Date:
November 20, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B23K35/26; C22C13/00; C22C13/02; H01L21/52; H01L23/40; H05K3/34
Domestic Patent References:
| WO2010047139A1 | 2010-04-29 |
Foreign References:
| JP2006035310A | 2006-02-09 | |||
| JP2005118800A | 2005-05-12 | |||
| JP2013033891A | 2013-02-14 | |||
| JP2011233879A | 2011-11-17 | |||
| JP2001150179A | 2001-06-05 | |||
| JP2011251310A | 2011-12-15 |
Attorney, Agent or Firm:
TSUTSUI, YAMATO (JP)
Tsutsui Daiwa (JP)
Tsutsui Daiwa (JP)
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