Title:
LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2008/013104
Kind Code:
A1
Abstract:
An SnCu-based lead-free solder alloy which eliminates a drawback that an intermetallic compound
excessively precipitates and the precipitate serves as nuclei to form dross
to thereby cause soldering defects including horning. It satisfies all of the
properties required for practical use. The solder alloy contains 0.1-1.5 wt.%
copper, 0.01-0.05 wt.%, excluding 0.05 wt.%, cobalt, 0.05-0.5 wt.% silver, and
0.01-0.1 wt.% antimony, the remainder being tin, and optionally further contains
0.001-0.008 wt.% germanium. The alloy prevents dross formation and eliminates
the drawback that soldering defects including horning occur.
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Inventors:
YAMADA SEIJI (JP)
SUGIMORI KENICHIRO (JP)
SUGIMORI KENICHIRO (JP)
Application Number:
PCT/JP2007/064312
Publication Date:
January 31, 2008
Filing Date:
July 20, 2007
Export Citation:
Assignee:
TOPY IND (JP)
NIPPON FILLER METALS KK (JP)
YAMADA SEIJI (JP)
SUGIMORI KENICHIRO (JP)
NIPPON FILLER METALS KK (JP)
YAMADA SEIJI (JP)
SUGIMORI KENICHIRO (JP)
International Classes:
B23K35/26; C22C13/00
Foreign References:
| JP2004330259A | 2004-11-25 | |||
| JP2003001482A | 2003-01-08 | |||
| JP2003094195A | 2003-04-02 | |||
| JPH11216591A | 1999-08-10 | |||
| JP2004141910A | 2004-05-20 | |||
| JP2005246480A | 2005-09-15 | |||
| JP2004330260A | 2004-11-25 | |||
| JP2002246742A | 2002-08-30 | |||
| JP2005153007A | 2005-06-16 |
Other References:
See also references of EP 1980355A4
Attorney, Agent or Firm:
INAGAKI, Hitoyoshi (4-24-3 ShinbashiMinato-ku Tokyo, 04, JP)
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