LEAD-FREE SOLDER ALLOY - SENJU METAL INDUSTRY CO

Title:

LEAD-FREE SOLDER ALLOY

Document Type and Number:

WIPO Patent Application WO/2012/128356

Kind Code:

A1

Abstract:

With the use of this solder alloy that includes 0.2 to 1.2 mass% Ag, 0.6 to 0.9 mass% Cu, 1.2 to 3.0 mass% Bi, 0.02 to 1.0 mass% Sb, and 0.01 to 2.0 mass% In, with the remainder comprising Sn, it is possible to achieve a portable device having excellent drop impact resistance and excellent temperature cycle properties such that thermal fatigue does not occur even during use in high-temperature environments such as the inside of a sun-heated vehicle and low-temperature environments such as snowy weather.

Inventors:

SHIMAMURA MASATO (JP)
OHNISHI TSUKASA (JP)
KOUSAI MITSUHIRO (JP)
TAKAGI KAZUYORI (JP)
NONAKA TOMOKO (JP)
SUZUKI MASAYUKI (JP)
HAYASHIDA TORU (JP)
ISHIBASHI SEIKO (JP)
YOSHIKAWA SHUNSAKU (JP)
YAMANAKA YOSHIE (JP)

Application Number:

PCT/JP2012/057540

Publication Date:

September 27, 2012

Filing Date:

March 23, 2012

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)
SHIMAMURA MASATO (JP)
OHNISHI TSUKASA (JP)
KOUSAI MITSUHIRO (JP)
TAKAGI KAZUYORI (JP)
NONAKA TOMOKO (JP)
SUZUKI MASAYUKI (JP)
HAYASHIDA TORU (JP)
ISHIBASHI SEIKO (JP)
YOSHIKAWA SHUNSAKU (JP)
YAMANAKA YOSHIE (JP)

International Classes:

B23K35/26; B23K35/22; B23K35/363; C22C13/02

Domestic Patent References:

WO2006129713A1	2006-12-07
WO2009011341A1	2009-01-22
WO2009011341A1	2009-01-22

Foreign References:

JP2008290150A	2008-12-04
JP2007237251A	2007-09-20
JP2005254298A	2005-09-22
JP2002018590A	2002-01-22
JPH1043882A	1998-02-17
JPH0550286A	1993-03-02
JPH09327790A	1997-12-22

Other References: