Title:
LEAD-FREE SOLDER ALLOY
Document Type and Number:
WIPO Patent Application WO/2020/067307
Kind Code:
A1
Abstract:
This lead-free solder alloy exhibits extremely favorable creep characteristics as a result of the added quantity of Cu being 0.1-2.0 mass%, the added quantity of Ni being 0.01-1.0 mass% and the added quantity of Ge being 0.001-2.0 mass%, with the remainder comprising Sn and unavoidable impurities, and enables a synergistic improvement in weld strength by adding, in the aforementioned composition, 0.1-5.0 mass% of Bi and/or Sb in place of Sn. This lead-free solder alloy may contain 0.1-8.0 mass% of Bi and/or 0.1-6.5 mass% of Sb. In addition, the ratio (Ge/Cu) of the content of Ge relative to that of Cu may be 0.005-0.5. In addition, the lead-free solder alloy may contain 0.1-8.0 mass% of Bi and 0.1-6.5 mass% of Sb, and the ratio (Bi/Sb) of the content of Bi relative to that of Sb may be 0.02-50.
Inventors:
NISHIMURA TETSURO (JP)
NISHIMURA TAKATOSHI (JP)
AKAIWA TETSUYA (JP)
SUENAGA SHOICHI (JP)
NISHIMURA TAKATOSHI (JP)
AKAIWA TETSUYA (JP)
SUENAGA SHOICHI (JP)
Application Number:
PCT/JP2019/037903
Publication Date:
April 02, 2020
Filing Date:
September 26, 2019
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD (JP)
International Classes:
B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
| WO2018174162A1 | 2018-09-27 |
Foreign References:
| JP2016129908A | 2016-07-21 | |||
| JP2018043265A | 2018-03-22 | |||
| JP2017087248A | 2017-05-25 | |||
| JP2019141881A | 2019-08-29 |
Attorney, Agent or Firm:
YANAGINO Takao et al. (JP)
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