Title:
LEAD-FREE SOLDER COMPOSITION FOR VEHICLE
Document Type and Number:
WIPO Patent Application WO/2011/145591
Kind Code:
A1
Abstract:
Disclosed is a lead-free solder composition for a vehicle, which is characterized by being composed of 26-56% by mass of In, 0-10% by mass of Ag and the balance, namely 34-74% by mass of Sn. The composition is useful as a solder composition for a feeding terminal, said solder composition being used for the purpose of forming a contact with glass for a vehicle.
Inventors:
NISHI, Mizuki (())
西 瑞樹 (())
西 瑞樹 (())
Application Number:
JP2011/061261
Publication Date:
November 24, 2011
Filing Date:
May 17, 2011
Export Citation:
Assignee:
CENTRAL GLASS COMPANY, LIMITED (5253, Oaza Okiube Ube-sh, Yamaguchi 01, 〒7550001, JP)
セントラル硝子株式会社 (〒01 山口県宇部市大字沖宇部５２５３番地 Yamaguchi, 〒7550001, JP)
NISHI, Mizuki (())
セントラル硝子株式会社 (〒01 山口県宇部市大字沖宇部５２５３番地 Yamaguchi, 〒7550001, JP)
NISHI, Mizuki (())
International Classes:
B23K35/26; C22C13/00; C22C28/00
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (Ekisaikai Bldg. 1-29, Akashi-cho, Chuo-k, Tokyo 44, 〒1040044, JP)
Claims: