Title:
LEAD-FREE VINYL CHLORIDE RESIN COMPOSITION AND EXTRUDED OBJECT BASED ON LEAD-FREE VINYL CHLORIDE
Document Type and Number:
WIPO Patent Application WO/2008/062560
Kind Code:
A1
Abstract:
A lead-free vinyl chloride resin composition which combines excellent thermal stability with the property of not fouling molds and has excellent secondary processability after short-term outdoor exposure; and a molded object. The vinyl chloride resin composition is characterized by comprising 100 parts by weight of a vinyl chloride resin and 0.01-1 part by weight of an epoxidized isocyanurate. Due to the introduction of an epoxy group into an isocyanurate, the composition can be satisfactory in the property of not fouling molds (not adhering to molds), weatherability, and heat resistance and can give an extruded object excellent in thermal stability and weatherability.
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Inventors:
ITO SYOJI (JP)
Application Number:
PCT/JP2007/001275
Publication Date:
May 29, 2008
Filing Date:
November 20, 2007
Export Citation:
Assignee:
MITSUBISHI PLASTICS INC (JP)
ITO SYOJI (JP)
ITO SYOJI (JP)
International Classes:
C08L27/06; C08K3/00; C08K5/3492; C08L63/00
Foreign References:
| JPH0328250A | 1991-02-06 | |||
| JP2000302913A | 2000-10-31 | |||
| JP2003061485A | 2003-03-04 | |||
| JPH03122149A | 1991-05-24 | |||
| JPH07216172A | 1995-08-15 | |||
| JP2002146199A | 2002-05-22 | |||
| JPH05125242A | 1993-05-21 | |||
| JPH04359986A | 1992-12-14 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (Akasaka 2-chomeMinato-k, Tokyo 52, JP)
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