Title:
LEAD SUPPORTING DEVICE OF A PUNCHING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2012/169803
Kind Code:
A3
Abstract:
The present invention relates to a lead supporting device of a punching apparatus. The lead supporting device of the punching apparatus includes: a frame of the punching apparatus; a lead coupled to the frame of the punching apparatus by a hinge shaft, the lead being rotated at a predetermined angle; main cylinders disposed on the frame of the punching apparatus and the lead to rotate the lead with respect to the frame; a head part elevatably disposed on the lead to perform a punching process; a rotatable guide body coupled to the frame of the punching apparatus by the hinge shaft; a guide rod rotatably hinge-coupled to the lead, the guide rod being slidable along the guide body; a lead position fixing unit including a grasping part disposed on the guide body to fix the guide rod to the guide body, thereby fixing the position of the lead with respect to the guide body.
Inventors:
IN SUK SHIN (KR)
Application Number:
PCT/KR2012/004501
Publication Date:
March 07, 2013
Filing Date:
June 07, 2012
Export Citation:
Assignee:
IN SUK SHIN (KR)
International Classes:
E02F5/20; E02F9/00
Foreign References:
| JPH0522688U | 1993-03-23 | |||
| JPH0711651A | 1995-01-13 | |||
| JP2007132090A | 2007-05-31 |
Other References:
See also references of EP 2719836A4
Attorney, Agent or Firm:
LEE, Jea Ryang (621-15 Dochen-dong, Gwangsan-gu, Gwangju 506-301, KR)
Download PDF:
Claims: