LEAD-THROUGH DEVICE THROUGH A METAL PLATE FOR AT LEAST ONE ELECTRICAL CONNECTION ELEMENT TO FORM AN ELECTRONIC CIRCUIT

WIPO Patent Application WO/2013/017376

A3

The invention relates to a lead-through device (1) through a metal plate (4) for at least one electrical connection element (6) to form an electronic circuit (8). For this purpose, the lead-through device (1) comprises a sealing element (10) which has a disc-shaped sealing element edge region (12) and a central lead-through region (14). The central lead-through region (14) encloses the at least one electrical connection element (6) in a media-tight manner. An opening edge region (16) of a lead-through opening (18) in the metal plate (4) is matched to the sealing element edge region (12) in a media-tight manner. A cylindrical portion (20) of the sealing element (10) in the sealing element edge region (12) has an outside diameter (DA) which is greater than an inside diameter (Di) of the lead-through opening (18), such that the cylindrical portion (20) forms a press fit in the lead-through opening (18). The cylindrical portion (20) has a pot-shaped sealing element region (40) which is in engagement with the lead-through opening (18) in the opening edge region (16).

OFFTERDINGER JOERG (DE)
KIENZLE RAINER (DE)
BUSS HEIKO (DE)
KIMMICH PETER (DE)
ER ABDULLAH (DE)
BECK WALTER (DE)

PCT/EP2012/063380

August 15, 2013

July 09, 2012

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BOSCH GMBH ROBERT (DE)
OFFTERDINGER JOERG (DE)
KIENZLE RAINER (DE)
BUSS HEIKO (DE)
KIMMICH PETER (DE)
ER ABDULLAH (DE)
BECK WALTER (DE)

H02G3/22

DE69508145T2	1999-10-28
DE102007022585A1	2008-11-27
GB2067683A	1981-07-30

ROBERT BOSCH GMBH (Stuttgart, DE)

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