LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME

Title:

LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2010/073660

Kind Code:

A1

Abstract:

Provided are a semiconductor device which has good electrical connection properties and bond strength by suppressing the occurrence of resin burrs, and a method for producing the same. Also provided is an LED device having good light emission characteristics due to improvement in the adhesion between a silicone resin and a wiring lead. By the self-organization of a functional organic molecule (11), an organic coating film (110) is formed on the surface of an outer lead (301a) boundary region of a QFP (10). The functional organic molecule (11) comprises a metal-binding first functional group (A1), a main chain moiety (B1) and a second functional group (C1) that exerts a hardening effect on a thermosetting resin. The main chain moiety (B1) comprises a glycol chain. Alternatively, the main chain moiety (B1) comprises a glycol chain together with one or more members selected from among a methylene chain, a fluoromethylene chain and a siloxane chain. Desirably, the main chain moiety (B1) contains one or more kinds of polar groups selected from among a hydroxyl group, a ketone, a thioketone, a primary amine, a secondary amine and an aromatic compound.

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Inventors:

FUKUNAGA TAKAHIRO
IMANISHI YASUKO

Application Number:

PCT/JP2009/007177

Publication Date:

July 01, 2010

Filing Date:

December 24, 2009

Export Citation:

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Assignee:

PANASONIC CORP (JP)
FUKUNAGA TAKAHIRO
IMANISHI YASUKO

International Classes:

C07D249/12; C07D251/20; C07D251/38; C07D487/04; C08L101/02; C09D5/00; C09D201/00; C23C26/00; H01L21/56; H01L23/28; H01L23/50

Foreign References:

JP2007266562A	2007-10-11
JP2004200349A	2004-07-15
JPS5557590A	1980-04-28
JPS5558072A	1980-04-30
JP2005132890A	2005-05-26
JP2004200350A	2004-07-15

Attorney, Agent or Firm:

NAKAJIMA, Shiro et al. (JP)
Shiro Nakajima (JP)

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