Title:
LEAK RESISTANT SEAMED STRUCTURE, METHOD OF FORMING SAME, AND HEAT PROCESSING DEVICE FOR SAME
Document Type and Number:
WIPO Patent Application WO/1997/042024
Kind Code:
A1
Abstract:
A seamed structure formed with seams which are soak- and leak-resistant to be suitable for three-dimensionally shaped, processed products such as shoes and the like, and a method of forming the same. The seamed structure has a feature in that a face material and a back material are seamed along seam lines through a hot melt adhevise resin layer, sewing needle holes defining the seam lines are filled with a part of a resin of the hot melt adhesive resin layer, and the face material is water-proof. The seamed structure can be prepared by a method which includes the following processes: (A) a process of preparing a precursor seamed layer structure by sewing the water-proof face material and the back material at least along the seam lines with a specified hot melt adhesive resin sheet between them; (B) while pressing the seamed layer structure by means of surfaces of a specified pressure plate body, applying sufficient high-frequency voltage to melt the hot melt adhesive resin sheet, thus fluidizing only the hot melt adhesive resin sheet and having a part of the resin sheet enter and fill into the sewing needle holes which constitute the seam lines. An embodiment of a method of forming the seamed structure is disclosed together with a high-frequency heating processing device, which is suitable for processing of shoes.
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Inventors:
KAMIYA MASAMI (JP)
Application Number:
PCT/JP1996/003403
Publication Date:
November 13, 1997
Filing Date:
November 20, 1996
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
KAMIYA MASAMI (JP)
KAMIYA MASAMI (JP)
International Classes:
A43B9/02; A43D11/12; (IPC1-7): B29D31/50; A43B9/02; A43B9/20
Foreign References:
| JPS3918384B1 | ||||
| JPH0732510A | 1995-02-03 | |||
| JPH04269901A | 1992-09-25 |
Other References:
See also references of EP 0949060A4
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