Title:
LEAKAGE DETERMINATION METHOD AND PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243078
Kind Code:
A1
Abstract:
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid to a contact member of a substrate holder, after a substrate held by the substrate holder is immersed in a plating liquid to perform plating; a measuring step 122 for measuring the electrical conductivity of the washing liquid after the contact member is washed; and a determination step 128 for determining the presence or absence of a plating liquid leak to the region where the contact member is disposed, on the basis of a comparison between a first electrical conductivity of the washing liquid, measured in advance for a reference substrate holder, and a second electrical conductivity of the washing liquid, measured in the measurement step 122.
Inventors:
TOMITA MASAKI (JP)
SEKI MASAYA (JP)
YAMAMOTO KENTARO (JP)
SEKI MASAYA (JP)
YAMAMOTO KENTARO (JP)
Application Number:
PCT/JP2022/024314
Publication Date:
December 21, 2023
Filing Date:
June 17, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D7/12; C25D17/00; C25D21/20
Foreign References:
| JP7047200B1 | 2022-04-04 | |||
| JP2005043069A | 2005-02-17 | |||
| JP2003003297A | 2003-01-08 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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