Title:
LEAN BREAD COOLING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2009/040958
Kind Code:
A1
Abstract:
A lean bread cooling method and apparatus with which even when the lean bread is
one of low fat content, there can be attained minimizing of water evaporation
during cooling, prevention of peeling after reheating of frozen lean bread and
maintaining of appropriate surface condition. There is provided a method of
cooling for a lean bread subjected to cooling before freezing after burning,
comprising the humidification cooling step of carrying out humidification
cooling of the lean bread after burning in an atmosphere of 35° to 45°C
temperature and 90 to 98% relative humidity, wherein the core temperature of
the lean bread immediately before the humidification cooling step is in the range
of 90° to 95°C.
Inventors:
KITAMURA, Kazushige (13-1, Botan 2-chome,Koto-k, Tokyo 46, 1350046, JP)
北村一茂 (〒46 東京都江東区牡丹２丁目１３番１号 株式会社前川製作所内 Tokyo, 1350046, JP)
北村一茂 (〒46 東京都江東区牡丹２丁目１３番１号 株式会社前川製作所内 Tokyo, 1350046, JP)
Application Number:
JP2007/069330
Publication Date:
April 02, 2009
Filing Date:
September 26, 2007
Export Citation:
Assignee:
MAYEKAWA MFG.CO., LTD. (13-1, Botan 2-chome Koto-k, Tokyo 46, 1350046, JP)
株式会社前川製作所 (〒46 東京都江東区牡丹２丁目１３番１号 Tokyo, 1350046, JP)
KITAMURA, Kazushige (13-1, Botan 2-chome,Koto-k, Tokyo 46, 1350046, JP)
株式会社前川製作所 (〒46 東京都江東区牡丹２丁目１３番１号 Tokyo, 1350046, JP)
KITAMURA, Kazushige (13-1, Botan 2-chome,Koto-k, Tokyo 46, 1350046, JP)
International Classes:
A21D15/02
Attorney, Agent or Firm:
TAKAHASHI, Masahisa et al. (Room 1003, Ambassador Roppongi Buildings16-13, Roppongi 3-chom, Minato-ku Tokyo 32, 1060032, JP)
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