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Title:
LEAN BREAD COOLING METHOD AND APPARATUS
Document Type and Number:
WIPO Patent Application WO/2009/040958
Kind Code:
A1
Abstract:
A lean bread cooling method and apparatus with which even when the lean bread is one of low fat content, there can be attained minimizing of water evaporation during cooling, prevention of peeling after reheating of frozen lean bread and maintaining of appropriate surface condition. There is provided a method of cooling for a lean bread subjected to cooling before freezing after burning, comprising the humidification cooling step of carrying out humidification cooling of the lean bread after burning in an atmosphere of 35° to 45°C temperature and 90 to 98% relative humidity, wherein the core temperature of the lean bread immediately before the humidification cooling step is in the range of 90° to 95°C.

Inventors:
KITAMURA, Kazushige (13-1, Botan 2-chome,Koto-k, Tokyo 46, 1350046, JP)
北村一茂 (〒46 東京都江東区牡丹2丁目13番1号 株式会社前川製作所内 Tokyo, 1350046, JP)
Application Number:
JP2007/069330
Publication Date:
April 02, 2009
Filing Date:
September 26, 2007
Export Citation:
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Assignee:
MAYEKAWA MFG.CO., LTD. (13-1, Botan 2-chome Koto-k, Tokyo 46, 1350046, JP)
株式会社前川製作所 (〒46 東京都江東区牡丹2丁目13番1号 Tokyo, 1350046, JP)
KITAMURA, Kazushige (13-1, Botan 2-chome,Koto-k, Tokyo 46, 1350046, JP)
International Classes:
A21D15/02
Domestic Patent References:
WO2005107480A1
WO1988002988A1
WO2005074801A1
Foreign References:
JPS5013552A
Other References:
See also references of EP 2193719A1
Attorney, Agent or Firm:
TAKAHASHI, Masahisa et al. (Room 1003, Ambassador Roppongi Buildings16-13, Roppongi 3-chom, Minato-ku Tokyo 32, 1060032, JP)
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