Title:
LED BULB MADE FROM COMBINATION OF MULTIPLE CIRCUIT BOARD PACKAGING MODULES
Document Type and Number:
WIPO Patent Application WO/2019/057143
Kind Code:
A1
Abstract:
The present application relates to an LED bulb made from a combination of multiple circuit board packaging modules, the bulb comprising: a glass bulb shell, a lamp holder, a driving power source module, circuit board packaging modules, and a glass stem, wherein a circuit board is a circuit board formed by means of injection molding after metal etching, a circuit board formed by means of mold-cutting metal injection molding, or, a foldable metal-based circuit board; a reflective cup is formed on the circuit board by means of injection molding, and chips are packaged in the reflective cup; then, multiple packaging modules are welded and connected in series and in parallel to the glass stem, and assembled with the glass bulb shell for sintering and sealing, and at the same time, a heat conduction gas is filled and sealed in the glass bulb shell; a power source output end of the driving power source module is connected to an electrode lead on the glass stem, and a power source input end thereof is connected to an electrode of the lamp holder; and the driving power source module is placed in the lamp holder, and the glass bulb shell is firmly bonded to the lamp holder, thus forming an LED bulb made from a combination of multiple circuit board packaging modules.
Inventors:
WANG DINGFENG (CN)
XU WENHONG (CN)
XU WENHONG (CN)
Application Number:
PCT/CN2018/106896
Publication Date:
March 28, 2019
Filing Date:
September 21, 2018
Export Citation:
Assignee:
WANG DINGFENG (CN)
International Classes:
F21K9/232; F21K9/68
Foreign References:
| CN207349841U | 2018-05-11 | |||
| CN207353245U | 2018-05-11 | |||
| CN206291015U | 2017-06-30 | |||
| CN201429032Y | 2010-03-24 | |||
| CN102767707A | 2012-11-07 | |||
| CN102062323A | 2011-05-18 | |||
| CN103883909A | 2014-06-25 | |||
| CN102147070A | 2011-08-10 | |||
| CN106468404A | 2017-03-01 | |||
| CN105226167A | 2016-01-06 | |||
| US20070291482A1 | 2007-12-20 | |||
| DE102012218181A1 | 2014-04-10 |
Attorney, Agent or Firm:
SHENZHEN ZHIQUAN INTELLECTUAL PROPERTY OFFICE (CN)
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