LED CHIP ASSEMBLY, LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE

Title:

LED CHIP ASSEMBLY, LED PACKAGE, AND MANUFACTURING METHOD OF LED PACKAGE

Document Type and Number:

WIPO Patent Application WO/2011/007874

Kind Code:

A1

Abstract:

Provided is a highly reliable LED package with significantly improved heat radiating properties, manufacturing method of the LED package, and an LED chip assembly used in the LED package. The LED package is characterized in that the LED chip assembly (10) is bonded to a circuit board (11) created by forming metal circuitry (3) on a metal substrate (5) with an insulation layer (4) therebetween, whereas an LED chip (1) of the LED chip assembly and the metal circuitry (3) of the circuit board are connected via an electrical connection member (9), and at least the LED chip assembly and the electrical connection member are encapsulated with resin encapsulant (8) including fluorescent material.

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Inventors:

HIGUMA SATOSHI (JP)
HIROTSURU HIDEKI (JP)
NARITA SHINYA (JP)

Application Number:

PCT/JP2010/062102

Publication Date:

January 20, 2011

Filing Date:

July 16, 2010

Export Citation:

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Assignee:

DENKI KAGAKU KOGYO KK (JP)
HIGUMA SATOSHI (JP)
HIROTSURU HIDEKI (JP)
NARITA SHINYA (JP)

International Classes:

H01L33/62; H01L23/373; H01L33/64

Domestic Patent References:

WO2008018482A1

2008-02-14

Foreign References:

JP2009123829A	2009-06-04
JP2008091831A	2008-04-17
JP2007165840A	2007-06-28
JP2007042749A	2007-02-15
JP2006128710A	2006-05-18
JP2008544488A	2008-12-04
JP3468358B2	2003-11-17
JPH0532485A	1993-02-09

Other References: