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Title:
LED CHIP AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/169770
Kind Code:
A1
Abstract:
Provided by the present invention are a light-emitting diode (LED) chip, a manufacturing method therefor, a display panel and an electronic device. The manufacturing method comprises: providing a substrate; sequentially forming a first semiconductor layer, an active layer, and a second semiconductor layer on the substrate; forming a first contact electrode which penetrates the active layer and the second semiconductor layer and which is electrically connected to the first semiconductor layer; forming a second contact electrode that is electrically connected to the second semiconductor layer on the second semiconductor layer; forming a first extension electrode that is electrically connected to the first contact electrode on the first contact electrode, the first extension electrode comprising a plurality of recessed points used for soldering; forming a second extension electrode that is electrically connected to the second contact electrode and that is isolated from the first extension electrode on the second contact electrode, the second extension electrode comprising a plurality of recessed points used for soldering. The present invention increases the yield of display panels.

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Inventors:
WEI DONG (CN)
XING RUBO (CN)
LIU HUIMIN (CN)
YANG XIAOLONG (CN)
WANG JIANTAI (CN)
Application Number:
PCT/CN2018/089793
Publication Date:
September 12, 2019
Filing Date:
June 04, 2018
Export Citation:
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Assignee:
KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CT CO LTD (CN)
KUNSHAN GOVISIONOX OPTOELECTRONICS CO LTD (CN)
International Classes:
H01L33/38
Foreign References:
CN105702823A2016-06-22
CN107546303A2018-01-05
JP2013201156A2013-10-03
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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