Title:
LED CHIP AND METHOD FOR FABRICATION THEREOF, CHIP WAFER, AND MICRO-LED DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/238395
Kind Code:
A1
Abstract:
The embodiments of the present disclosure provide an LED chip and method for fabrication thereof, chip wafer, and Micro-LED display device. the LED chip (2) comprises a first semiconductor pattern (20), a light emission pattern (30), and a second semiconductor pattern (40), arranged stacked in sequence; the boundary of the orthographic projection of the first semiconductor pattern (20) and/or the second semiconductor pattern (40) on the light emission pattern (30) is located within the boundary of the light emission pattern (30); the first semiconductor pattern (20), the second semiconductor pattern (40), and the light emission pattern (30) have overlapping regions along the direction of the thickness of the LED chip (2); the first semiconductor pattern (20) is an n-type semiconductor, and the second semiconductor pattern (40) is a p-type semiconductor; alternatively, the first semiconductor pattern (20) is a p-type semiconductor, and the second semiconductor pattern (40) is an n-type semiconductor. The embodiments of the present disclosure can prevent the leakage channel formed because of the damage of the side wall of the LED chip (2), and further prevent the impact thereof on the luminous efficiency of the LED chip (2).
Inventors:
HOU MENGJUN (CN)
LI YANZHAO (CN)
MENG HU (CN)
LIU ZONGMIN (CN)
LI YANZHAO (CN)
MENG HU (CN)
LIU ZONGMIN (CN)
Application Number:
PCT/CN2020/082453
Publication Date:
December 03, 2020
Filing Date:
March 31, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L27/15; H01L33/00; H01L33/20
Foreign References:
| CN110164900A | 2019-08-23 | |||
| CN101887934A | 2010-11-17 | |||
| CN108336204A | 2018-07-27 | |||
| US5812576A | 1998-09-22 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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