Title:
LED DECORATIVE STRIP, MANUFACTURING METHOD THEREOF, AND BACKLIGHT MODULE AND KEYBOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/075864
Kind Code:
A1
Abstract:
An LED strip for use in a backlight module, manufacturing method thereof, and backlight module and keyboard using the same. The LED decorative strip comprises a substrate layer (1), an electrically conductive layer (2), a circuit coating layer (3), and an adhesive backing layer (4). The electrically conductive layer (2) is a sliver paste circuit layer formed by printing, and has one face including a non-solder region and several solder regions. Each of the solder regions is provided with an LED silver paste solder bump (5) protruding from the electrically conductive layer (2), and an LED lamp (6) is soldered to the LED silver paste solder bump (5). The non-solder region is covered by the circuit coating layer (3). In the LED decorative strip, a silver paste is used to form an electrically conductive layer and to provide a protruding LED silver paste solder bump, so as to increase an impedance of a loop where an LED lamp is located without adding a protective resistor connected in series, thereby reducing a manufacturing cost, simplifying the manufacturing process, and improving a product pass rate.
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Inventors:
WANG YU (CN)
LIN SHIYAO (CN)
LIN SHIYAO (CN)
Application Number:
PCT/CN2015/097548
Publication Date:
May 11, 2017
Filing Date:
December 16, 2015
Export Citation:
Assignee:
KUNSHAN JOING TECH CO LTD (CN)
International Classes:
H01H13/83; F21S4/00; H05K1/18; H05K3/12; H05K3/34; F21Y115/10
Foreign References:
| CN205194592U | 2016-04-27 | |||
| CN204227209U | 2015-03-25 | |||
| CN104134564A | 2014-11-05 | |||
| CN202697035U | 2013-01-23 | |||
| CN101365302A | 2009-02-11 | |||
| CN203839257U | 2014-09-17 | |||
| EP1947693A1 | 2008-07-23 | |||
| US20040223328A1 | 2004-11-11 |
Attorney, Agent or Firm:
SUZHOU CREATOR PATENT & TRADEMARK AGENCY LTD. (CN)
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