Title:
LED DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/208495
Kind Code:
A1
Abstract:
Provided is an LED device presenting minimal risk of bottom-surface contamination even when foreign substances such as liquids adhere thereto. The LED device (1) has an LED die (9), a submount substrate (4) on the surface of which the LED die is mounted, a frame-shaped electrode (5) disposed along the outer circumferential part of the bottom surface of the submount substrate, and an inner-side electrode (8) surrounded by the frame-shaped electrode and connected to the electrode of the LED die (9). In the LED device (1), the frame-shaped electrode is disposed along the entire outer circumferential part of the bottom surface. In an LED device (120), the bottom surface is rectangular, and the frame-shaped electrode is disposed along three sides of the bottom surface.
Inventors:
MIYASHITA ISAO (JP)
KUMASAKA TAKU (JP)
WATANABE KEITA (JP)
TSUCHIYA KOSUKE (JP)
KUMASAKA TAKU (JP)
WATANABE KEITA (JP)
TSUCHIYA KOSUKE (JP)
Application Number:
PCT/JP2014/066540
Publication Date:
December 31, 2014
Filing Date:
June 23, 2014
Export Citation:
Assignee:
CITIZEN HOLDINGS CO LTD (JP)
CITIZEN ELECTRONICS (JP)
CITIZEN ELECTRONICS (JP)
International Classes:
H01L33/62
Domestic Patent References:
| WO2012022782A1 | 2012-02-23 |
Foreign References:
| JP2012044218A | 2012-03-01 | |||
| JPS6352422A | 1988-03-05 | |||
| JP2009130237A | 2009-06-11 | |||
| JP2005191097A | 2005-07-14 |
Other References:
See also references of EP 3016154A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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