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Title:
LED EQUIPMENT PURPOSE WAFER, METHOD FOR MANUFACTURING SAME, AND LED-EQUIPPED STRUCTURE USING LED EQUIPMENT PURPOSE WAFER
Document Type and Number:
WIPO Patent Application WO/2011/013754
Kind Code:
A1
Abstract:
Provided is an LED equipment purpose wafer having a small difference in coefficient of linear thermal expansion from an LED and having an excellent heat conductivity, a method for manufacturing the LED equipment purpose wafer, and an LED-equipped structure manufactured by using the LED equipment purpose wafer. The LED equipment purpose wafer (6) is constituted of a metal impregnation ceramic complex (61) and a protection layer (62) that is formed therearound. It is preferable that the metal impregnation ceramic complex (61) has a metal thin layer (63) on a surface thereof. The method for manufacturing the wafer is characterized by comprising filling at least one selected from the group consisted of ceramic porous bodies, ceramic powder compacts, and ceramic powders into a tubular body made of metal or ceramic, then impregnating metal into a gap portion held by at least one selected from the group consisted of the ceramic porous bodies, the ceramic powder compacts, and the ceramic powders, and thereafter performing a process.

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Inventors:
HIROTSURU HIDEKI (JP)
ISHIHARA YOSUKE (JP)
TSUKAMOTO HIDEO (JP)
Application Number:
PCT/JP2010/062808
Publication Date:
February 03, 2011
Filing Date:
July 29, 2010
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK (JP)
HIROTSURU HIDEKI (JP)
ISHIHARA YOSUKE (JP)
TSUKAMOTO HIDEO (JP)
International Classes:
H01L33/48; H01L21/02; H01L33/64
Foreign References:
JP2008294482A2008-12-04
JP2001105124A2001-04-17
JP2007142479A2007-06-07
JPH06295848A1994-10-21
JP2007150076A2007-06-14
JP2008010809A2008-01-17
JPH06155253A1994-06-03
JP2007250979A2007-09-27
JP2007005709A2007-01-11
JP2005117006A2005-04-28
JPH0573252B21993-10-14
JP2006128710A2006-05-18
Other References:
See also references of EP 2461379A4
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
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