Title:
LED FILAMENT SUBSTRATE, LED PACKAGE STRUCTURE, AND LED LAMP
Document Type and Number:
WIPO Patent Application WO/2019/119639
Kind Code:
A1
Abstract:
The present invention is applicable to the technical field of light emitting diode (LED) applications, and provides an LED filament substrate, an LED package structure, and an LED lamp. The LED filament substrate comprises an insulating base, conductive layers, and pins connected to an external power supply circuit. The conductive layers are provided on the surface of the insulating base. The conductive layers are connected to external LED chips. The shape of the conductive layers is determined according to the types and connection mode of the external LED chips. The number of the conductive layers is determined according to the types and number of the external LED chips and the spacing between the external LED chips. The pins are provided on the insulating base. According to the LED filament substrate, the LED package structure, and the LED lamp provided in this solution, the conductive layers are provided on the LED filament substrate, multiple types of LED chips can be selected, and the spacing and series-parallel connection mode of the LED chips are not limited, and therefore, the arrangement of the LED chips on the LED filament substrate is diversified.
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Inventors:
ZHANG LIJUN (CN)
Application Number:
PCT/CN2018/077112
Publication Date:
June 27, 2019
Filing Date:
February 24, 2018
Export Citation:
Assignee:
SHENZHEN REFOND OPTOELECTRONICS CO LTD (CN)
International Classes:
H01L33/62; F21K9/90; F21V19/00; H01L25/075; H01L33/48
Foreign References:
| CN204227119U | 2015-03-25 | |||
| US20090168403A1 | 2009-07-02 | |||
| EP1036416A1 | 2000-09-20 |
Attorney, Agent or Firm:
SHENZHEN ZHONGYI PATENT AND TRADEMARK OFFICE (CN)
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