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Patent Searching and Data


Title:
LED LAMP PROVIDED WITH HEAT DISSIPATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/206323
Kind Code:
A1
Abstract:
An LED lamp provided with a heat dissipation substrate, comprising a light emitting diode and light transmissive masks (20), the light emitting diode comprising a printed circuit board (11), M light emitting wafers (16), and a heat dissipation substrate (12), M being a natural number greater than or equal to 1, and the number of light transmissive masks (20) being M. The printed circuit board (11) and the heat dissipation substrate (12) are bonded together and M through openings are disposed in the printed circuit board (11), each light emitting wafer (16) being arranged at an opening and the bottom of the light emitting wafer (16) being attached to the surface of the heat dissipation substrate (12). A circuit is etched onto a surface conductive copper layer of the printed circuit board (11), the pins (161) of each light emitting wafer (16) all being electrically connected to the circuit on the printed circuit board (11). Each light transmissive mask (20) masks a light emitting wafer (16), each light transmissive mask (20) comprising a mask body, the cross-section of the mask body being in the shape of a circular arch, and the inner walls of the mask body being provided with alternately concave and convex light transmissive strip grooves (22) arranged in parallel along the longitudinal direction of the axis of the mask body, the light transmissive strip grooves (22) being distributed in a wave shape. The present LED lamp provided with a heat dissipation substrate has good heat dissipation and soft light rays.

Inventors:
YUAN, Zhi'xian (Room 6D2, No.3 Building Tian'an Cyber Park, Futia, Shenzhen Guangdong 0, 518000, CN)
Application Number:
CN2016/093529
Publication Date:
December 07, 2017
Filing Date:
August 05, 2016
Export Citation:
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Assignee:
YUAN, Zhi'xian (Room 6D2, No.3 Building Tian'an Cyber Park, Futia, Shenzhen Guangdong 0, 518000, CN)
International Classes:
F21K9/00; F21V29/503; F21V29/70; F21V29/89; H01L33/64
Foreign References:
CN102155634A2011-08-17
CN201827830U2011-05-11
CN205690089U2016-11-16
CN102646776A2012-08-22
CN203836663U2014-09-17
CN204271124U2015-04-15
US20110128731A12011-06-02
Attorney, Agent or Firm:
SHENZHEN YUANHANG INTELLECTUAL PROPERTY OFFICE(GENERAL PARTNER) (Room 1019, Shenzhen International Cultural Building Futian Rd., Futia, Shenzhen Guangdong 3, 518033, CN)
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