LED LIGHT HEAT RADIATING SYSTEM USING HIGHLY EFFICIENT HEAT TRANSFER MEDIUM

WIPO Patent Application WO/2016/200203

A1

The present invention relates to a large LED light using an LED chip as a light source and particularly to an LED light heat radiating system using a highly efficient heat transfer medium and maximizing the heat radiating effect of an LED light by effectively conducting, to the heat radiating body of the LED light, high-temperature heat radiated through the heat radiating point of an LED chip mounted in the LED light. The LED light heat radiating system for radiating heat using a highly efficient heat transfer medium, according to the present invention, comprises: two via holes having a diameter of 0.7-0.9 mm formed between the LED chip heat radiating point bonding copper foil surface of the upper copper foil surface of a PCB assembly, which is contacted by the heat radiating point of each LED chip mounted on the upper copper foil surface of the PCB assembly of the LED light, and the lower copper foil surface of the PCB assembly; a copper layer formed in the via holes by copper (Cu) plating; and the heat transfer medium having the outer surface of a tin chip coated with a silver (Ag) layer having a thickness of 3-5 ㎛ formed as a result of filling the space inside the copper layer with a cream solder, which is formed from a mixture of 96% tin (Sn) and 4% silver (Ag), and heating same using a reflow heater.

LEE YOUNG SEB (KR)

PCT/KR2016/006181

December 15, 2016

June 10, 2016

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TECHEN CO LTD (KR)

F21V29/89; F21S8/08; F21V29/70; H01L33/64; F21W131/103

JP5685863B2	2015-03-18
KR101080883B1	2011-11-08
JP2011228184A	2011-11-10
JP2011258346A	2011-12-22
JP2013016345A	2013-01-24

SEONG, NAK HOON (KR)
성낙훈 (KR)

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