Title:
LED LIGHTING ASSEMBLY WITH IMPROVED HEAT MANAGEMENT
Document Type and Number:
WIPO Patent Application WO/2005/109533
Kind Code:
A1
Abstract:
The present invention provides a lighting assembly that incorporates a high intensity LED package (500) into an integral housing (506) for further incorporation into other useful lighting devices. The present invention primarily includes three housing components, namely an inner mounting die (512), an outer enclosure (506) and an outer housing (502) that cooperate to enhance the heat management of the overall assembly. The inner (512) and outer (506) components cooperate to retain the LED package (514), provide electrical and control connections, provide integral heat sink capacity and includes an integrated reflector cup. Surface area enhancements (518) on the outer surface of the outer enclosure (506) are aligned with openings (504) in the outer housing (502) to allow efficient air flow around the LED assembly (500) to enhance cooling. In this manner, high intensity LED packages (514) can be incorporated into lighting assemblies with reduced risk of overheating and malfunction.
Inventors:
GALLI ROBERT D (US)
Application Number:
PCT/US2004/015630
Publication Date:
November 17, 2005
Filing Date:
May 19, 2004
Export Citation:
Assignee:
GALLI ROBERT D (US)
International Classes:
F21L4/02; F21V7/00; F21V29/00; F21S8/10; (IPC1-7): H01L33/00
Foreign References:
| US2928934A | 1960-03-15 | |||
| US5183328A | 1993-02-02 | |||
| US5223747A | 1993-06-29 | |||
| US5634711A | 1997-06-03 | |||
| US5785418A | 1998-07-28 |
Other References:
See also references of EP 1741145A4
Attorney, Agent or Firm:
Tetreault, Mark E. (Josephs & Holmes Ltd., 101 Dyer Street,
5th Floo, Providence RI, US)
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