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Patent Searching and Data


Title:
LED LIGHTING ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2010/036033
Kind Code:
A2
Abstract:
The present invention relates to an LED lighting assembly, comprising: a plurality of heat dissipating plates, each plate being formed of a folded portion and wings extended bilaterally from the folded portion; a PCB, which is disposed on the heat dissipating plates and has at least one LED (light emitting diode) mounted thereon; and an electrical connection element, which is provided on a lower side of the heat dissipating plate and is electrically connected with the PCB as well as with an external power supply, wherein the folded portions of the heat dissipating plates are tightly coupled to each other, the wings are spread out along the circumference of the folded portions, and the wing of each heat dissipating plate further includes a contact portion formed by extending at least a part of the upper end thereof in the horizontal direction, with the top face of the contact portion being tightly coupled to the bottom face of the PCB to receive heat directly from the electric circuit board.

Inventors:
PARK, Sang-Woong (1 Ssangyong Apt, Dangsu-dong Gwonseon-g, Suwon-city Gyeonggi-do 441-762, 441-762, KR)
박상웅 (경기도 수원시 권선구 당수동 쌍용아파트, 441-762 Gyeonggi-do, 441-762, KR)
Application Number:
KR2009/005440
Publication Date:
April 01, 2010
Filing Date:
September 24, 2009
Export Citation:
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Assignee:
ZALMAN TECH CO., LTD. (1007, Daeryung Techno Town III448, Gasan-dong, Gumchun-gu, Seoul 153-803, 153-803, KR)
잘만테크(주) (서울특별시 금천구 가산동 448 대륭테크노타운 3차 1007호, 153-803 Seoul, 153-803, KR)
PARK, Sang-Woong (1 Ssangyong Apt, Dangsu-dong Gwonseon-g, Suwon-city Gyeonggi-do 441-762, 441-762, KR)
International Classes:
F21V29/00; F21V29/00
Attorney, Agent or Firm:
Y.P. LEE, MOCK & PARTNERS (1575-1 Seocho-dong, Seocho-gu, Seoul 137-875, 137-875, KR)
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