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Patent Searching and Data


Title:
LED MODULE
Document Type and Number:
WIPO Patent Application WO/2015/074323
Kind Code:
A1
Abstract:
An LED module comprising an LED (3), a PCB (2), a lens (4), a lens mask (6), and a heat-dissipation component (1). The heat-dissipation component (1) comprises an aluminum heat-dissipation frame (11), a thermally-conductive plate (14), a connecting assembly element (12), and multiple heat-dissipation fins (13). Multiple heat-dissipation fin mounting holes (111) arranged in parallel are provided on the aluminum heat-dissipation frame (11). The heat-dissipation fins (13) are inserted into the heat-dissipation fin mounting holes (111) on the aluminum heat-dissipation frame (11). The PCB (2) is fixed onto the bottom surface of the aluminum heat-dissipation frame (11). The thermally-conductive plate (14) is arranged between the PCB (2) and the heat-dissipation fins (13) on the aluminum heat-dissipation frame (11). Wiring via positions are provided on the aluminum heat-dissipation frame. The positions of the wiring via positions are located between corresponding electric interfaces (121) and electrically-conductive interfaces (21). The LED module has a novel structure and great heat dissipation performance. Also, the number of heat-dissipation fins can be selected on the basis of need to adjust the heat dissipation performance. The module can be assembled freely, has great water resistance, and is suitable for outdoor use.

Inventors:
WANG LINA (CN)
WANG YUANCHENG (CN)
Application Number:
PCT/CN2014/000893
Publication Date:
May 28, 2015
Filing Date:
October 08, 2014
Export Citation:
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Assignee:
WANG LINA (CN)
International Classes:
F21V21/002; F21S2/00; F21V23/00; F21V29/00; F21V29/508; F21V29/70; F21Y101/02
Foreign References:
CN103604055A2014-02-26
CN203671300U2014-06-25
CN202532251U2012-11-14
CN102954410A2013-03-06
CN202660505U2013-01-09
CN103032854A2013-04-10
CN203231280U2013-10-09
US20110317420A12011-12-29
Other References:
See also references of EP 2918896A4
None
Attorney, Agent or Firm:
HANGZHOU FENGHE PATENT ATTORNEYS OFFICE CO., LTD (CN)
杭州丰禾专利事务所有限公司 (CN)
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