Title:
LED MODULE
Document Type and Number:
WIPO Patent Application WO/2021/054025
Kind Code:
A1
Abstract:
Provided is an LED module comprising: a first layer which forms a first flat surface; an LED chip which is disposed on the first flat surface; a second layer which surrounds the LED chip and forms a convex part on the first flat surface; and a third layer which is disposed on the outer side of the LED chip and overlaps a portion of the upper surface of the first layer, lateral surface of the second layer, and upper surface of the second layer. The convex part of the second layer is lower than the upper surface of the LED chip. The first layer, the second layer, and the third layer are electroconductive films.
Inventors:
ABE HIDEAKI (JP)
YAMADA KAZUYUKI (JP)
ASADA KEISUKE (JP)
UOGISHI KOTA (JP)
TAKEMASA KENICHI (JP)
ISONO DAIKI (JP)
YAMADA KAZUYUKI (JP)
ASADA KEISUKE (JP)
UOGISHI KOTA (JP)
TAKEMASA KENICHI (JP)
ISONO DAIKI (JP)
Application Number:
PCT/JP2020/031243
Publication Date:
March 25, 2021
Filing Date:
August 19, 2020
Export Citation:
Assignee:
JAPAN DISPLAY INC (JP)
International Classes:
H01L33/60; G09F9/33; H01L33/62
Foreign References:
| JP2012089816A | 2012-05-10 | |||
| JP2005039100A | 2005-02-10 | |||
| JP2009524930A | 2009-07-02 |
Attorney, Agent or Firm:
TAKAHASHI, HAYASHI AND PARTNER PATENT ATTORNEYS, INC. (JP)
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