LED PACKAGE HAVING A THERMOELECTRIC COOLING DEVICE EMBEDDED THEREIN

WIPO Patent Application WO/2011/129514

A1

Disclosed is an LED package having a thermoelectric cooling device embedded therein. An LED device is mounted on the top surface of a circuit board. The thermoelectric cooling device is installed adjacent to the LED device and parallel to the top surface of the circuit board. A sealant is formed over the LED device and the thermoelectric cooling device.

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KIM, Jung Yup (4 Expo Apt, Jeonmin-dong Yuseong-gu, Daejeon 305-762, 305-762, KR)
김정엽 (대전광역시 유성구 전민동 엑스포아파트, 305-762 Daejeon, 305-762, KR)
HYUN, Seung Min (110-904 BanseokMaeul Apt, Jijok-dong Yuseong-gu, Daejeon 305-772, 305-772, KR)
현승민 (대전광역시 유성구 지족동 반석마을아파트 110동 904호, 305-772 Daejeon, 305-772, KR)
PARK, Hyun-Sung (3 Expo Apt, Jeonmin-dong Yuseong-gu, Daejeon 305-761, 305-761, KR)

KR2010/009132

October 20, 2011

December 21, 2010

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KOREA INSTITUTE OF MACHINERY & MATERIALS (171 Jang-dong, Yuseong-gu, Daejeon 305-343, 305-343, KR)
한국기계연구원 (대전광역시 유성구 장동 171, 305-343 Daejeon, 305-343, KR)
KIM, Jung Yup (4 Expo Apt, Jeonmin-dong Yuseong-gu, Daejeon 305-762, 305-762, KR)
김정엽 (대전광역시 유성구 전민동 엑스포아파트, 305-762 Daejeon, 305-762, KR)
HYUN, Seung Min (110-904 BanseokMaeul Apt, Jijok-dong Yuseong-gu, Daejeon 305-772, 305-772, KR)
현승민 (대전광역시 유성구 지족동 반석마을아파트 110동 904호, 305-772 Daejeon, 305-772, KR)

H01L33/64; F21V29/00

KIM, Dong Jin (3F Samdong Bldg. 1337-3, Seocho 2-dong Seocho-gu, iSeoul 137-860, 137-860, KR)

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