Title:
LED PACKAGE HAVING A THERMOELECTRIC COOLING DEVICE EMBEDDED THEREIN
Document Type and Number:
WIPO Patent Application WO/2011/129514
Kind Code:
A1
Abstract:
Disclosed is an LED package having a thermoelectric cooling device embedded therein. An LED device is mounted on the top surface of a circuit board. The thermoelectric cooling device is installed adjacent to the LED device and parallel to the top surface of the circuit board. A sealant is formed over the LED device and the thermoelectric cooling device.
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Inventors:
KIM JUNG YUP (KR)
HYUN SEUNG MIN (KR)
PARK HYUN-SUNG (KR)
JANG BONG KYUN (KR)
HAN SEUNG-WOO (KR)
HYUN SEUNG MIN (KR)
PARK HYUN-SUNG (KR)
JANG BONG KYUN (KR)
HAN SEUNG-WOO (KR)
Application Number:
PCT/KR2010/009132
Publication Date:
October 20, 2011
Filing Date:
December 21, 2010
Export Citation:
Assignee:
KOREA MACH & MATERIALS INST (KR)
KIM JUNG YUP (KR)
HYUN SEUNG MIN (KR)
PARK HYUN-SUNG (KR)
JANG BONG KYUN (KR)
HAN SEUNG-WOO (KR)
KIM JUNG YUP (KR)
HYUN SEUNG MIN (KR)
PARK HYUN-SUNG (KR)
JANG BONG KYUN (KR)
HAN SEUNG-WOO (KR)
International Classes:
H01L33/64; F21V29/00
Foreign References:
| US20060179849A1 | 2006-08-17 | |||
| KR20090029341A | 2009-03-23 | |||
| JP2007066696A | 2007-03-15 | |||
| JP2007150329A | 2007-06-14 | |||
| JP2006294782A | 2006-10-26 | |||
| KR20060061435A | 2006-06-08 |
Attorney, Agent or Firm:
KIM, DONG JIN (KR)
김동진 (KR)
김동진 (KR)
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Claims: